Method for manufacturing touch panel

Abstract

The invention relates to a method for manufacturing a touch panel, which comprises the steps of: providing a substrate with a touch area and a periphery area; forming a sensing circuit layer comprising a plurality of first sensing series, a plurality of second cellular metal sensing pads and a plurality of periphery circuits on a touch area of the substrate; forming an insulating layer provided with a plurality of first contact windows and a plurality of second contact windows on the substrate so as to cover the sensing circuit layer; exposing the partial areas of the second cellular metal sensing pads by the first contact windows; and forming a transparent conductive layer comprising a plurality of second transparent bridging lines and a plurality of transparent contact pads on the insulating layer in the touch control area of the substrate, wherein each second transparent bridging line is respectively and electrically connected with two adjacent second cellular metal sensing pads by two first contact windows, and each transparent contact pad is respectively and electrically connected with the corresponding periphery circuits by the second contact windows.

Description

technical field [0001] The present invention relates to a manufacturing method of a touch panel, and in particular to a manufacturing method of a capacitive touch panel. Background technique [0002] Touch panels are roughly classified into resistive touch panels, capacitive touch panels, optical touch panels, acoustic wave touch panels, and electromagnetic touch panels according to their sensing methods. Since the capacitive touch panel has the advantages of fast response time, good reliability and high durability, the capacitive touch panel has been widely used in electronic products. [0003] Generally, the capacitive touch panel includes a plurality of first sensing series extending along a first direction and a plurality of second sensing series extending along a second direction. Wherein, each first sensing series is composed of a plurality of first sensing pads connected in series with a first bridge portion, and each second sensing series is formed of a plurality of...

AI Technical Summary

Problems solved by technology

However, the resistance of indium tin oxide (ITO) is too high, which easily leads to the problem of poor sensitivity of the touch panel.

In order to solve the above-mentioned problem of high resistance value, the known technology also proposes to use metal material to replace part of ITO to make the first bridge part or the second bridge part, so as to reduce the problem of high resistance value of the sensing series.

[0004] In order to reduce the process steps of the touch panel and reduce the production cost, manufacturers try to reduce the number of processes of the touch panel. Taking the production of the uppermost insulating layer as an example, if the uppermost insulating layer is not produced, the metal material The first bridging portion or the second bridging portion will be directly exposed to the external environment, which will easily lead to oxidation of the metal, thereby greatly reducing the reliability and service life of the touch panel.

Moreover, if the contact pads connecting the peripheral area of ​​the touch panel to the external circuit are made of metal, the metal contact pads will inevitably be directly exposed to the outside air environment before connecting to the external circuit, which will also easily lead to oxidation of the metal. Then the reliability and service life of the touch panel are greatly reduced

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