Backboard, board card and network device
A technology for backplanes and boards, which is applied in the field of boards and network equipment and backplanes, can solve problems such as heat loss and interference, and achieve the effect of reducing interference
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Embodiment 1
[0028] Figure 3a A schematic top view of a partial structure of the backplane provided by Embodiment 1 of the present invention. Such as Figure 3a As shown, the backplane of this embodiment includes a substrate 1, on which a power interface 2, a plurality of slots 3, a first positioning pin 5, and power wiring 6 are arranged; 4 to connect, where Figure 3a The connecting wiring 4 shown is only a schematic example. The specific layout of the connecting wires 4 is determined by the interconnection relationship between the slots 3 . In this field, the connecting wire 4 is usually a copper wire.
[0029] Wherein, the power interface 2 is used for outputting current, which may be an output port of a power module directly installed on the substrate 1, or an output port of a power connector on the substrate 1 connected to a power connector on the power backplane. This embodiment does not limit the specific implementation of the power interface 2, which may depend on the struct...
Embodiment 2
[0041] Figure 4 A schematic top view of a partial structure of the backplane provided by Embodiment 2 of the present invention. This embodiment is realized based on Embodiment 1, such as Figure 4 As shown, the difference between this embodiment and Embodiment 1 is that a plurality of first positioning pins 5 are provided on one side of each slot 3 on the substrate 1 of this embodiment. Figure 4 Take 2 as an example. Among them, by increasing the number of first positioning pins 5 corresponding to each slot 3, multiple power supply paths can be formed, and the current of each path can be reduced by using multiple power supply paths, thereby improving the overall current carrying capacity. Wherein, the number of the first positioning pins 5 corresponding to each slot 3 can be determined in combination with the actual substrate layout and current requirements.
[0042] In addition, in this embodiment, the current-carrying capacity can be further improved by increasing the w...
Embodiment 3
[0044] Figure 5a A schematic top view of the partial structure of the backplane provided by Embodiment 3 of the present invention; Figure 5b A schematic side view of a partial structure of the backplane provided by Embodiment 3 of the present invention. This embodiment can be realized based on the above-mentioned embodiment 1 or embodiment 2, such as Figure 5a and Figure 5b As shown, the difference from the above-mentioned embodiment is that the substrate 1 of this embodiment is also provided with a second positioning pin 8, and the second positioning pin 8 is located on the other side of the slot 3 corresponding to the first positioning pin 5, It is used to provide a ground signal to form a current loop with the first positioning pin 5 .
[0045] Wherein, the first positioning pin 5 in the above-mentioned embodiments of the present invention carries the power signal, and usually a ground signal is required on the backplane, and the ground signal can use the ground sign...
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