Explosion positioning method of manually made PCB (Printed Circuit Board)

Abstract

The invention discloses an explosion positioning method of a manually made PCB (Printed Circuit Board). The method comprises the following steps of: (1) aligning the hole patterns of transparent paper: aligning the print hole patterns on the transparent paper under the transmission of light or sunlight and then clamping the transparent paper with a clip; (2) fixing the transparent paper and glassboards: firstly, arranging the clamped transparent paper in an interlayer of the two glass boards, then, positioning the glass boards with a protractor and finally and respectively positioning the upper transparent paper and the lower transparent paper on the upper glass board and the lower glass board by filling an adhesive in small holes on the glass boards; and (3) placing the PCB, removing the clip on the transparent paper, arranging the PCB in the interlayer of the transparent paper, positioning the glass boards with the protractor, vacuumizing in an explosion box and exploding. The invention can not cause pattern dislocation.

Description

Technical field [0001] The invention relates to a method for manually making PCB board exposure and positioning. Background technique [0002] The basic process of the existing hand-made PCB board is as follows: [0003] Step 1: Print the developed graphics. Will draw a good PCB board diagram (see figure 1 ), respectively print the top (front) and bottom (bottom) graphics of the figure on transparent paper (see figure 2 , image 3 ). [0004] Step 2: Alignment of transparent paper graphics. Under the light or sunlight, align all the holes of the two graphics on the transparent paper, and use a sticker at the edge of the paper. And put the PCB board with photosensitive material in the interlayer of transparent paper. (Such as Figure 4 ) [0005] The third step: Exposure and development. Place the work made in the second step in the exposure box, evacuate the upper and lower transparent papers close to the PCB board, and turn on the light of the exposure box for exposure. Exposu...

AI Technical Summary

Problems solved by technology

[0007] The above method is easy to cause the misalignment of the upper and lower hole graphics

In the process of vacuuming, it is difficult to ensure that the bonding part of the self-adhesive is located in the middle of the thickness direction of the PCB board, so it is easy to cause the dislocation of the upper and lower hole patterns

Image 6 The sticker on the right side of the center is offset upwards, and the sticker on the left is offset downwards, so that the upper graphic moves to the left and the lower graphic moves to the right, resulting in inaccurate positioning

Images