Resin composite for filling through hole and preparation method thereof

A technology of resin composition and solvent, which is applied in the direction of conductive materials dispersed in non-conductive inorganic materials, metal pattern materials, printed circuit parts, etc., can solve the problems of high viscosity and influence on printing performance, and achieve high viscosity and printing performance. Good performance, the effect of improving the conduction effect

Inactive Publication Date: 2012-05-09
IRICO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method has a high viscosity of the slurry system, which has a great influence on the printing performance.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] 1) First prepare the organic vehicle: the selected polymer resin is Shell Epon 827, the curing agent is Degussa Dyhard 100s; the accelerator is 1121; the diluent is D-1402, the solvent is dibutyl carbitol, mix and set aside;

[0032] The content of each component is:

[0033] Polymer resin: 75%;

[0034] Curing agent: 8%;

[0035] Accelerator: 2%;

[0036] Thinner: 13%;

[0037] Solvent: 2%.

[0038] 2) Then prepare conductive powder: select the flake silver powder of the following specifications with a particle diameter of 1 to 10 μm and a tap density of 1.0 to 2.5 g / ml; a dendritic silver powder with a particle diameter of <0.5 μm and a bulk density of 0.7 to 1.1 g / ml; the particle diameter of nano-scale nickel powder is 60-100nm, the bulk density is 0.06-0.8g / ml, mixed;

[0039] The content of each component is:

[0040] Flake silver powder 20%;

[0041] Dendritic silver powder 40%;

[0042] Nanoscale nickel powder 40%;

[0043] 3) Measure 2% solvent butyl c...

Embodiment 2

[0048] 1) First prepare the organic carrier: the selected polymer resin is Shell Epon 827, the curing agent is Degussa Dyhard 100s; the accelerator is Degussa Dyhard UR-300; the diluent is D-1402, and the solvent is butyl carbit Alcohol, mixed for later use;

[0049] The content of each component is:

[0050] Polymer resin: 90%;

[0051] Curing agent: 7%;

[0052] Accelerator: 2%;

[0053] Thinner: 1%.

[0054] 2) Then prepare conductive powder: select the flake silver powder of the following specifications with a particle diameter of 1 to 10 μm and a tap density of 1.0 to 2.5 g / ml; a dendritic silver powder with a particle diameter of <0.5 μm and a bulk density of 0.7 to 1.1 g / ml; the particle diameter of nano-scale nickel powder is 60-100nm, the bulk density is 0.06-0.8g / ml, mixed;

[0055] The content of each component is:

[0056] Flake silver powder 35%;

[0057] Dendritic silver powder 20%;

[0058] Nanoscale nickel powder 45%;

[0059] 3) measure 3% solvent but...

Embodiment 3

[0064] 1) First prepare the organic carrier: the selected polymer resin is Shell Epon 827, the curing agent is Degussa Dyhard 100s; the accelerator is Degussa Dyhard UR-300; the diluent is D-1402, and the solvent is butyl carbit Alcohol, mixed for later use;

[0065] The content of each component is:

[0066] Polymer resin: 78%;

[0067] Curing agent: 10%;

[0068] Accelerator: 5%;

[0069] Thinner: 6%;

[0070] Solvent: 1%.

[0071] 2) Then prepare conductive powder: select the flake silver powder of the following specifications with a particle diameter of 1 to 10 μm and a tap density of 1.0 to 2.5 g / ml; a dendritic silver powder with a particle diameter of <0.5 μm and a bulk density of 0.7 to 1.1 g / ml; the particle diameter of nano-scale nickel powder is 60-100nm, the bulk density is 0.06-0.8g / ml, mixed;

[0072] The content of each component is:

[0073] Flake silver powder 32%;

[0074] Dendritic silver powder 38%;

[0075] Nanoscale nickel powder 30%;

[0076] 3) ...

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Abstract

The invention discloses a resin composite for filling a through hole and a preparation method thereof. The preparation method comprises the following steps of: (1) firstly, preparing an organic carrier: selecting 75-91 percent of macromolecular resins, 7-10 percent of curing agents, 2-5 percent of promoting agents, 1-13 percent of diluting agents and 0-2 percent of solvents to be mixed for later use; (2) then, preparing conductive powder: selecting 20-35 percent of sheet-shaped silver powder, 20-40 percent of dendritic silver powder and 30-45 percent of nanometer-grade nickel powder to be mixed; (3) metering 0-3 percent of solvents; and (4) preparing the resin composite: taking 45-75 percent of pre-mixed conductive powder to be added into 23-55 percent of organic carrier, adding 0-3 percent of solvents into the mixture to be mixed; and stirring by a stirrer and grinding by a three-roller machine to obtain final conductive slurry, wherein the drying temperature of the slurry is 150 DEGC and the drying time is 60 minutes in the use process. The composite can improve the printing performance and the conduction performance, and can reduce the production cost.

Description

technical field [0001] The invention relates to a conductive composition for printed circuit boards, in particular to a conductive composition for filling through holes and a preparation method thereof, which is filled into holes of an insulating bottom plate and used for connecting circuits on both sides of the bottom plate. Background technique [0002] As the demand for miniaturization and cost control of electronic equipment assembly increases, there are circuits on both layers of the insulating substrate. The through holes on the insulating base plate are bridges and bonds connecting the front circuit and the back circuit. The through-hole conductive paste plays the role of connecting and conducting electricity. Through-hole conductive paste is prepared by mixing silver powder and other conductive metal powder into a paste state, and then pouring it into the hole by printing and other technological means to form conduction. The amount of metal powder added, viscosity,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L63/02C08K7/00C08K3/08H01B1/22H05K1/09
Inventor 朱万超
Owner IRICO
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