Material for manufacturing modified phenolic fireproofing insulation board

Abstract

The invention relates to the technical field of building materials, in particular to a material for manufacturing a modified phenolic fireproofing insulation board and a preparation method thereof. The material for manufacturing the modified phenolic fireproofing insulation board comprises the following components in part by weight: 100 parts of modified phenolic resin, 2 to 4 parts of surfactant, 5 to 7 parts of foaming agent and 8 to 10 parts of curing agent. Due to the adoption of the technical scheme, the free phenol of the material is 0.09 percent, the free formaldehyde is less than 0.1 percent, the release amount of the formaldehyde is reduced obviously, and the physical and chemical properties of the material have no obvious difference compared with those of phenolic foam prepared under the normal condition, so the material can be applied to interior wall construction (interior wall heat-insulating systems) of buildings.

Description

technical field [0001] The invention relates to the technical field of building materials, in particular to a material for preparing a modified phenolic fireproof insulation board. Background technique [0002] Due to the high energy consumption of buildings, serious energy waste is a very common problem. Therefore, building energy conservation is a direct and cheap systematic project to alleviate energy shortage. Currently used building insulation materials, such as extruded polystyrene boards and polystyrene boards, have potential safety hazards due to their shortcomings such as flammability, toxic smoke, and poor water absorption. Phenolic foam has the characteristics of easy availability of raw materials, low price, excellent product performance, flame retardant, self-extinguishing, low smoke, good waterproof and air permeability, etc., and can be well used in interior wall insulation systems, so it is increasingly valued by the people . But prior art phenolic foam is ...

AI Technical Summary

Problems solved by technology

However, the content of free phenol and free aldehyde in phenolic resin is relatively high, which is highly...