Polycrystalline silicon ingot ripping method
A technology for polycrystalline silicon ingots and polycrystalline silicon, which is applied to fine working devices, stone processing equipment, manufacturing tools, etc., can solve the problems of low cutting efficiency, high energy consumption, and high pollution, and achieve the effect of improving production efficiency and reducing manufacturing costs.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0024] Explanation of related terms:
[0025] Diamond steel wire: A layer of nickel is electroplated on the ordinary steel wire, and then diamond particles are electroplated on the nickel. It belongs to the fixed type wire cutting consumables. Compared with the previous free type, the cutting ability is greatly enhanced.
[0026] Broken ingot: Divide a whole polysilicon ingot into several small silicon blocks (16 or 25 pieces).
[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0028] The invention provides...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com