Continuous vertical hot evaporation metal film coating method

Abstract

The invention discloses a novel continuous vertical hot evaporation metal film coating method. Metal film materials are coated on samples above a hot evaporation source in a vapor deposition way through a hot evaporation source at the bottom. The invention is characterized in that a slit type straightening device is arranged between the hot evaporation source and a sample conveying mechanism, divergent metal molecules sent from the hot evaporation source are filtered, and metal molecule flows vertically facing substrate materials of samples are formed, wherein the depth-to-width ratio of the slit of the straightening device is smaller than a half of the depth-to-width ratio of a surface relief sculpture structure of the substrate materials of the samples. In the application and the implementation of the invention, only the metal molecules flying approximately in the vertical direction are allowed to be deposited on the surface of substrate materials, so the invention is favorable for reducing or eliminating the side wall deposition of the surface relief sculpture structure on substrate materials, avoids the interconnection of the top of the relief sculpture structure and metal films at the bottom, and enhances double-layer metal wire grating structures required by the metal wire grating formation polarization technology.

Description

technical field [0001] The invention relates to a method for metal coating, in particular to a method for limiting the flight direction of metal molecules for realizing continuous vertical thermal evaporation metal coating on the surface of a large-area base material. The method is aimed at the metal coating application of the relief structure on the surface of the base material, and can solve the problem of interconnection between the top layer of the relief structure and the bottom metal coating film. Background technique [0002] The metal wire grid polarization technology uses the double-layer metal wire grid structure on the surface to filter the polarization component of the incident light. The manufacturing method of the double-layer metal wire grid is as follows: firstly, a relief structure in the form of a wire grid is formed on the surface of the base material by a micro-nano processing method, the width of the wire grid is in the order of microns or less, and then...

AI Technical Summary

Problems solved by technology

Due to the non-vertical deposition of metal molecules, metal film deposition 202 is formed on the sidewall of the relief structure 201 on the surface of the substrate, causing the upper surface of the relief structure and the metal film at the bottom of the opening to be connected to each other, so that the polarization function of the metal wire grid is invalid.

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