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Radiation device with wind scooper

A technology of heat dissipation device and air guide cover, which is applied in the direction of cooling/ventilation/heating transformation, semiconductor devices, semiconductor/solid-state device components, etc., which can solve problems such as poor heat dissipation performance, improve airflow utilization, and facilitate disassembly and assembly , sufficient cooling effect

Inactive Publication Date: 2010-09-08
郏松筠
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Aiming at the defects of poor heat dissipation performance of the existing heat dissipation radiators in the external wind field, the present invention provides a heat dissipation device with a wind guide cover: the flow velocity of the air flowing through the radiator can be greater than the flow velocity of the external wind field; The air flow and flow velocity in the high temperature area; the air flow and flow velocity in the downstream area of ​​​​the radiator will not be reduced, and the heat dissipation performance will be improved from three aspects

Method used

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Embodiment Construction

[0021] The substantive features of the present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0022] As shown in the drawings, a heat dissipation device with a wind guide cover includes a heat conduction base 8 and a heat dissipation fin group 9 arranged on it. The fin group 9 is rectangular, and each fin is arranged in parallel and at intervals. An airflow channel is formed between the fins, and the fins are extended from the heat conduction base 8 . A “∏”-shaped air guide cover 1 is sleeved on the periphery of the fin group 9, and one end of the air guide cover 1 is extended to form an air inlet with a flared surface 4, and the other end forms a “∏”-shaped air outlet. The above-mentioned airflow channel communicates with the air inlet and the air outlet, and the top surface of the air guide 2 is in conflict with the fin group 9 or forms a gap of ≤ 3mm. The entire air guide 1 can be made of iron sheet or pla...

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Abstract

The invention relates to a radiation device with a wind scooper. Conventional radiators have the disadvantages of the low wind speed of a high-temperature area, the high wind speed of a low-temperature area and poor radiation effect. The radiation device with the wind scooper comprises a heat-conducting pedestal and a radiation fin set arranged on the heat-conducting pedestal. The radiation device is characterized in that: the TT-shaped wind scooper is sleeved on the periphery of the radiation fin set; and one end of the wind scooper is externally extended to form a wind inlet with an externally-extended surface, while the other end is provided with a TT-shaped wind outlet. The radiation device with the wind scooper has the advantages of making the flow speed of airflows flowing through the radiator higher than that of an external wind field, increasing the airflow and flow speed of the high-temperature area of the radiator, not decreasing the airflow and the flow speed of a downstream area of the radiator and improving radiation performance from three aspects.

Description

technical field [0001] The invention relates to an air-cooled heat dissipation device for electronic power devices and electronic chips, in particular to a heat dissipation device with an air guide cover, which is suitable for heat dissipation of small-power frequency converters and CPUs. technical background [0002] Electronic power devices and electronic chips that need to be forced to dissipate heat generally achieve the purpose of cooling through the radiator. The conventional radiator consists of a heat conduction base and a plurality of heat dissipation fins extended from the heat conduction base. Through the bottom plane of the heat conduction base The power device absorbs heat, and then dissipates heat from other surfaces of the heat conduction base and the surface of the fins on it. Such as figure 1 As shown, the existing type of heat dissipation type radiator in the external wind field does not have a fan itself, but the airflow through the external wind field fl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/467
Inventor 郏松筠
Owner 郏松筠
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