Platinum black pulse plating method based on ultrasonic assistance
A pulsed electroplating, ultrasonic-assisted technology, applied in the field of ultrasonic-assisted platinum black pulse electroplating, can solve the problems of poor adhesion between the coating and the substrate, large diameter of platinum black particles, easy to fall off, etc., to achieve increased charge storage, AC impedance Reduced, good binding effect
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Embodiment 1
[0019] Such as figure 1 Shown, the present embodiment is prepared through the following steps:
[0020] The first step is to clean the platinum electrodes and platinum wire auxiliary electrodes to be electroplated;
[0021] The cleaning refers to ultrasonic cleaning.
[0022] The second step is to put the platinum electrode to be electroplated and the platinum wire auxiliary electrode vertically into the electroplating solution, and connect the negative and positive poles of the power supply respectively;
[0023] The diameter of the platinum electrode to be electroplated is 60 μm, and the width of the electrode point is 60 μm.
[0024] Described electroplating solution refers to the solution obtained by dissolving 3 gram of chloroplatinic acid and 0.01 gram of lead acetate in 100 gram of water.
[0025] The third step is to put the electroplating tank filled with electroplating solution into the ultrasonic generator, turn on the ultrasonic generator and apply pulse current...
Embodiment 2
[0030] Such as figure 2 Shown, the present embodiment is prepared through the following steps:
[0031] The first step is to clean the platinum electrode and platinum wire counter electrode to be electroplated;
[0032] The cleaning refers to ultrasonic cleaning.
[0033] The second step is to put the platinum electrode to be electroplated and the platinum wire auxiliary electrode vertically into the electroplating solution, and connect the negative and positive poles of the power supply respectively;
[0034] The diameter of the platinum electrode to be electroplated is 200 μm, and the width of the electrode points is 200 μm.
[0035] Described electroplating solution refers to the solution obtained by dissolving 3 gram of chloroplatinic acid and 0.01 gram of lead acetate in 100 gram of water.
[0036] The third step is to put the electroplating tank filled with electroplating solution into the ultrasonic generator, turn on the ultrasonic generator and apply pulse current...
Embodiment 3
[0041] Such as image 3 Shown, the present embodiment is prepared through the following steps:
[0042] The first step is to clean the platinum electrodes and platinum wire auxiliary electrodes to be electroplated;
[0043] The cleaning refers to ultrasonic cleaning.
[0044] The second step is to put the platinum electrode to be electroplated and the platinum wire auxiliary electrode vertically into the electroplating solution, and connect the negative and positive poles of the power supply respectively;
[0045] The diameter of the platinum electrode to be electroplated is 400 μm, and the width of the electrode point is 400 μm.
[0046] Described electroplating solution refers to the solution obtained by dissolving 3 gram of chloroplatinic acid and 0.01 gram of lead acetate in 100 gram of water.
[0047] The third step is to put the electroplating tank filled with electroplating solution into the ultrasonic generator, turn on the ultrasonic generator and apply pulse curre...
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