Side-view type LED packaging structure as well as production method and application thereof

Abstract

The invention relates to a side-view type LED packaging structure as well as a production method and application thereof. The side-view type LED packaging structure comprises a silicon substrate, a first conducting pin, a second conducting pin and a first LED chip. The silicon substrate comprises a groove which defines the exit surface of the side-view type LED packaging structure; the first conducting pin is positioned on at least part of the groove and extends to one outer surface of the silicon substrate; the second conducting pin is positioned on at least part of the groove and extends to the outer surface of the silicon substrate, and the first conducting pin and the second conducting pin are separated electrically; the first LED chip comprises a first electrode and a second electrode which are respectively electrically connected with the first conducting pin and the second conducting pin in the groove; and the outer surface of the silicon substrate is perpendicular to the exit surface.

Description

technical field [0001] The present invention relates to a light-emitting diode (LED) packaging structure, and in particular to a side-view (Side View Type) light-emitting diode packaging structure and its application on LED light bars and LED backlight modules. Background technique [0002] In the trend of energy saving and environmental protection, light emitting diodes have become the most attractive energy-saving light sources to replace existing light sources. Among light-emitting diode light sources, surface-mounted (SMD) light-emitting diodes are widely used. Since the general LED chip cannot convert most of the input electric energy into light energy, and most of it is lost in the form of heat energy, the conversion efficiency of the LED chip is not high. In addition, if the heat generated during the operation of the LED chip cannot be effectively removed, the junction temperature (Junction Temperature) of the LED chip will rise sharply, which will further lead to a ...

AI Technical Summary

Problems solved by technology

First of all, since the light emitting diode packaging structure 100 is a top view type (Top View Type) light emitting diode structure with a large size, it cannot be applied in a backlight module with a light and thin light guide plate design.

Secondly, the material of the packaging base 102 and the semiconductor material of the LED chip 104 have a large difference in expansion coefficient, which is likely to affect the bonding between the packaging base 102 and the LED chip 104 due to thermal expansion, thereby resulting in the reliability of the LED packaging structure 100. degree drop

Furthermore, the surface of the package base 102 usually needs to be cleaned by plasma during manufacture, but after plasma cleaning, the surface of the package base 102 made of poly-phthalamide is damaged, so that the package base The reflection effect of the surface of 102 becomes worse, which affects the light output

In addition, the design of the heat conduction block 114 makes the thickness of the conductive pins 106 uneven and has a large drop, which will cause the process of making the conductive pins 106 to be too complicated, and will cause residual material problems, which is not conducive to cost reduction.

Images