Flat-angle chip aslant sticking type back-off packaged electronic tag

Abstract

The invention relates to a flat-angle chip aslant sticking type back-off packaged electronic tag comprising a flat-angle chip and a diagonal antenna, wherein one side of the flat-angle chip is provided with two binding points at interval, the flat-angle chip is aslant stuck on the pins of the diagonal antenna, and the two binding points of the flat-angle chip are respectively connected with the two pins of the diagonal antenna. Because of adopting the aslant back-off packaging technology to pack the flat-angle chip, the flat-angle chip aslant sticking type back-off packaged electronic tag of the invention ensures that the flat-angle chip can be matched with the diagonal antenna so as to enlarge the using range of the flat-angle chip; and when the flat-angle chip is replaced, the original diagonal antenna does not need to redesign, so that the research cost is lowered.

Description

technical field [0001] The invention relates to an electronic label, in particular to an electronic label with a flat-angle chip obliquely pasted upside down and packaged. Background technique [0002] The electronic tag is composed of an antenna and a chip, and the chip is connected to the pin of the antenna through the binding point on it. In the prior art, there are two types of chips, one is a flat-angle chip, such as Figure 1A As shown, the feature of the flat-angle chip 1 is that the two binding points 11 and 12 on it are arranged on the same side, and another kind of diagonal chip, such as Figure 1B As shown, the diagonal chip 2 is characterized by two binding points 21 and 22 arranged on the diagonal. [0003] In the prior art, there are two pins of the antenna, which are respectively connected to a binding point of the chip, such as Figure 2A , 2B As shown, there are also two types of antenna pin settings, in Figure 2A Among them, the two pins 31 and 32 of t...

AI Technical Summary

Problems solved by technology

like Figure 3A-3D As shown, according to the horizontal upside-down packaging technology in the prior art, no matter how the flat-angle chip 1 is placed, it cannot form a loop with the diagonal antenna, so it cannot be used in conjunction with the diagonal antenna.

[0005] see Figure 4 , shown as a flat-angle chip 6 with a test point, the flat-angle chip 6 with a test point is provided with a test point 63 between the two binding points 61 and 62, when the test point 63 is in contact with the antenna coil, it will cause a circuit short circuit, burn bad electronic tag

[0006] In the prior art, when the flat-angle chip 6 with the test point is packaged on the flat-angle antenna by adopting the horizontal reverse packaging technology, since the distance between the two pins 31 and 32 is very small, the test point 63 reaches the two pins 31 and 32. The distance between them is very small, such as Figure 5 As shown, therefore, using the existing horizontal upside-down packaging technology, the packaging fault tolerance is low, resulting in a high probability of defective products, and the efficiency of the chip packaging process is low.

[0007] The disadvantage of chip upside-down packaging technology in the prior art is that the flat-angle chip can only be used in conjunction with the flat-angle antenna, and the scope of use is narrow. When you only have a diagonal antenna and a flat-angle chip in your hand, in order to make the two work together, you have to modify the antenna. pins or modify the setting method of the chip binding point, which increases the cost of research and development

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