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Packing baseplate for LED light source

An LED light source and packaging substrate technology, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as light decay, and achieve the effects of reducing light pollution, improving light efficiency utilization, and increasing heat conduction area.

Inactive Publication Date: 2010-06-30
吴锏国
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Generally, the best heat dissipation effect of LED lamps can only be maintained at about 80 degrees, and after 3-6 months, light decay may occur due to overheating

Method used

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  • Packing baseplate for LED light source
  • Packing baseplate for LED light source
  • Packing baseplate for LED light source

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] The present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.

[0034] The invention relates to a package substrate of an LED light source which has a simple structure, high light efficiency utilization rate and can effectively solve the problem of heat dissipation, comprising a package base plate 1, a hollow package frame 2 and a heat conduction electrode 3, and the heat conduction electrode 3 is arranged on the package frame 2 The upper base surface of the package frame 2 is stacked on the package base plate 1, and the package base plate 1 in the package frame 2 is provided with a protrusion 4, and the protrusion 4 is a nonlinear spherical shape. The back side of the protrusion 4 is a cavity 5 . The packaging frame 2 is provided with an inner frame 6 , and the height of the frame 6 is the same as that of the protrusion 4 of the packaging bottom plate 1 .

[0035] The package bottom plate 1 is a...

Embodiment 2

[0038] The protrusion 4 is in the shape of a boss. All the other are with embodiment 1.

Embodiment 3

[0040] The protrusion 4 is a cone. All the other are with embodiment 1.

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PUM

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Abstract

The present invention relates to a packing baseplate for an LED light source. The packing baseplate comprises a packing soleplate, a hollow packing box and heat conducting electrodes, wherein the heat conducting electrodes are installed on the upper base face of the packing box, the lower base face of the packing box is placed on the packing soleplate, and packing soleplate inside the packing box is provided with a protrusion. A wafer is fixed on the protrusion so that the wafer fixing surface is higher than the packing box, thereby solving the problem that effective light of 30% of peripheral lighting angles is shaded because the wafer fixing surface is lower than the packing box in the existing recessed packing with a flat plate. The back of the packing soleplate is provided with a chamber corresponding to the front protrusion, which is convenient for filling heat conducting materials and guarantees the tight joint between the back of the packing soleplate and a radiator for better heat conduction.

Description

technical field [0001] The invention relates to a package substrate of an LED light source. Background technique [0002] High-power LED lighting has the advantages of low energy consumption, long service life, no pollution, and no radiant heat. It is a typical low-carbon economic industry, representing the fourth-generation lighting source revolution, and is an inevitable trend to replace traditional lighting fixtures. At present, its realization There are two ways: [0003] One is that a single high-power LED chip is individually packaged as a single light source, and multiple high-power LED single light sources are combined to form a light source suitable for lighting requirements. This combination of lighting sources is easy to solve heat dissipation, and the lumen value of a single chip package is high, but the visual effect is poor, and the shadows on the road overlap, which is easy to cause visual fatigue or dizziness, and there are many lamp circuit ports, the syste...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/62H01L33/64
Inventor 吴锏国
Owner 吴锏国
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