Photosensitive resin composition and a sealant

A photosensitive resin and composition technology, applied in optics, optomechanical equipment, nonlinear optics, etc., can solve the problems of decreased hydrofluoric acid resistance, softened hydrofluoric acid resistance, low molecular weight of sealants, etc., to prevent hydrogen Decreased hydrofluoric acid resistance, reduced possibility of breakage, effects of excellent hydrofluoric acid resistance

Active Publication Date: 2010-05-26
TOKYO OHKA KOGYO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if a sealant is applied to a glass plate with a narrow gap, the viscosity of the existing sealant requires a long time for the sealant to penetrate into the gap of the glass plate, and the penetration of the sealant into the gap Poor, sealant that has not fully penetrated to the inside overflows the outside of the glass pane, creating a convex protrusion
Therefore, the above-mentioned convex protrusions may be thicker than the glass plate after etchi

Method used

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  • Photosensitive resin composition and a sealant
  • Photosensitive resin composition and a sealant
  • Photosensitive resin composition and a sealant

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preparation example Construction

[0147]

[0148] The photosensitive resin composition of the present invention can be obtained by mixing all the above-mentioned components with a mixer. Moreover, you may filter using a filter in order to make the obtained mixture uniform.

[0149] The photosensitive resin composition thus obtained preferably has a viscosity of 0.5 to 3.0 Pa·s, more preferably has a viscosity of 0.7 to 2.0 Pa·s, and particularly preferably has a viscosity of 1.0 to 1.8 Pa·s. With a viscosity within this range, the permeability to the inside of the glass plate can be improved, and breakage of the glass plate after etching can be prevented. In addition, although the viscosity also depends on the size of the gap (gap) between the glass plates, by making the viscosity 0.5 Pa·s or more, the applicability of the photosensitive resin composition can be well maintained, and the glass plates can be sufficiently sealed; When the viscosity is 3.0 Pa·s or less, the permeability to the inside of the gla...

Embodiment 1～12

[0159]

[0160] As (A) component, (B) component, and (C) component, the compound described in Table 1 was mix|blended in the ratio of Table 1, respectively, and the photosensitive resin composition was prepared. The viscosity (25°C) at this time is shown in the table.

[0161] In addition, (A)-1 in a table|surface shows EBECRYL3701: Modified epoxy acrylate (made by Daicel Cytek) which has a bisphenol A frame|skeleton, (A)-2 shows CNUVE151: Polyester acrylate (made by Sartomer). M140 means N-acryloyloxyethyl hexahydrophthalimide (manufactured by Toya Synthetic); GBLMA means α-methacryloyloxy-γ-butyrolactone (Osaka Organic); HEMA means hydroxyethyl methacrylate; PHA stands for 3-phenoxy-2-hydroxyacrylate; MAHP stands for monoacryloyloxyethyl hexahydrophthalate.

[0162] In addition, SR833 represents tricyclodecane dimethanol diacrylate (manufactured by Sartomer) as a bifunctional monomer (E).

[0163] As the photopolymerization initiator (C), IR907 (manufactured by Chiba Spe...

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Abstract

The invention provides photosensitive resin composition with excellent tolerance and permeability and a sealant. The photosensitive resin composition in the invention comprises the following components: a tail end (methyl radical) acrylic ester oligomer (A), more than one kind of monomer (B) selected from a monomer (b1) represented by the following formula (1) and a monomer (b2) represented by the following formula (2), a photopolymerization initiator (C). [Formula 1] (in the formula, A represents radical with annular amide group or annular imide, and their nitrogen-atoms combine with residuein formula (1); R1, R1' and R2 independently represent hydrogen atom or methyl radical ; a and b independently represent integer from 1 to 3). [Formula 2] (in the formula, R3 represents hydrogen atomor methyl radical; B represents single key, or alkylidene with carbon number from 1 to 5; R4 represents residue formed by removing one hydrogen atom bonded to carbon atom of the single ring or multi ring cyclic lactone compound).

Description

technical field [0001] The present invention relates to a photosensitive resin composition and a sealant. Background technique [0002] In recent years, along with the demand for thinner display panels of liquid crystal televisions, mobile phones, etc., thinner display devices such as liquid crystal display panels are also required. In order to reduce the thickness of display devices, methods of manufacturing glass plates by bonding thin glass together, and methods of thinning the glass part by physical or chemical means after manufacturing the glass plates have been studied. Among them, in the method of manufacturing a glass plate by laminating thin glass, since the strength is insufficient due to the use of thin glass, it is considered that the possibility of breaking the glass plate during the manufacturing process increases. Therefore, it has been proposed to manufacture a glass plate by laminating glass of usual thickness, and then polishing or etching the glass surfac...

Claims

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Application Information

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IPC IPC(8): G03F7/027G02F1/1339
Inventor 高木利哉植松照博桃泽绫
Owner TOKYO OHKA KOGYO CO LTD
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