Method of flexibly connecting microelectrode array with printed circuit board (PCB)

Abstract

The invention discloses a method of flexibly connecting a microelectrode array with a printed circuit board (PCB), comprising the following steps: making a PCB interface board; welding a spring needlesocket on the PCB interface board, and inserting a spring needle into the spring needle socket to form an elastic needle bed; aligning the head of the spring needle with a microelectrode array interface microelectrode to make the head of the spring needle contact the microelectrode array interface microelectrode through compressing the spring needle by a fastening screw; connecting the lead wireson the end of the spring needle socket with an electrophysiological signal amplifier and a electrophysiological signal stimulator, and making the lead wire ends correspond to microelectrodes in the central parts one to one to electrically connect the microelectrode array with the peripheral circuit. The invention shortens the PCB interface board making cycle, reduces the PCB interface board making cost, ensures that the elastic needle bed and the microelectrode array interface microelectrode are well contacted without wearing the metal layers on the surfaces of the microelectrode array interface microelectrode and affecting the conducting performance of the microelectrode array interface microelectrode and prolongs the service life of the microelectrode array.

Description

technical field [0001] The invention relates to a cell electrophysiological sensor-microelectrode array, which is suitable for large-scale electrode arrays of various silicon and silicon dioxide substrates, and particularly relates to a flexible connection between a microelectrode array and a printed circuit board (PCB) circuit through an elastic needle bed Methods. Background technique [0002] Microelectrode array is a product of the combination of microelectronics technology and biosensing technology. It is one of the latest tools for researching cognitive science, drug screening and DNA sequence analysis. It can record the local potential changes of cells directly adjacent to different periods in vitro for a long time to obtain interesting information; it can stimulate and record multiple sites at the same time, while maintaining accurate focus on single cells; moreover, the The method is also non-invasive, so it will not damage the cells, combined with the optical reco...

AI Technical Summary

Problems solved by technology

The substrate of the microelectrode array is usually transparent quartz glass or silicon, and the interface electrodes are distributed around the substrate. It is difficult to ensure that all solder joints are on the same plane by ordinary welding methods, so it is impossible to ensure a good connection between the electrode array and the external PCB circuit.

[0005] In addition, the microelectrode interface electrode generally deposits a metal layer with a thickness of about 0.3 to 0.5 microns on the substrate by sputtering, while the solder joints of ordinary welding are generally tapered. By applying a certain pressure, the solder joints and electrodes are conductive It will inevitably cause wear to the electrode, and the conductivity of the electrode will decrease after a period of time

Wire ball bonding can bond one end of the wire to the metal layer of the device, and the other end to the pad of the PCB board to realize the electrical connection between the device and the peripheral circuit. Gold wires are widely used in wire ball bonding. The cost is high, the process is complicated, the gold wire is easy to break, the stability is difficult to guarantee, and it is inconvenient for the operator to use it repeatedly

[0006] At present, most of the existing microelectrode array interfaces on the market use special fixtures. Due to the use of non-standard devices, the production process requirements are high and the price is expensive. In addition, the electrodes are also worn when clamping.

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