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Forming machine for conducting wire of glass-sealed diode

A glass-encapsulated diode and molding machine technology, which is applied in the manufacture of semiconductor devices, circuit/current collector parts, semiconductor/solid-state devices, etc., can solve the problems of low dimensional accuracy of formed products, low production efficiency, rough surface, etc., and achieve Product quality change, production efficiency improvement, smooth surface effect

Active Publication Date: 2010-02-24
光路新能源材料(上海)有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The original wire products are molded by the wire forming machine. The dimensional accuracy of the formed products is low, the surface is rough, there are defects such as pinch marks, scratches, and burrs, and the production efficiency is not high.

Method used

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  • Forming machine for conducting wire of glass-sealed diode
  • Forming machine for conducting wire of glass-sealed diode
  • Forming machine for conducting wire of glass-sealed diode

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Embodiment Construction

[0010] The present invention will be further described below in conjunction with accompanying drawing.

[0011] like Figure 1~3 As shown, the glass-encapsulated diode wire forming machine includes a machine platform 1, a thread cutting mechanism 2, a front mold 3, a rear mold 4, a bumper 5 arranged on the machine platform 1, and a pushing mechanism 6 for driving the above-mentioned components. The combination of the front mold 3 and the rear mold 4 can form a mold cavity, and the thread cutting mechanism 2 includes a threading block 7 with a threading hole, the outlet end of the threading block 7 is adjacent to the inlet end of the mold cavity, and the There is a cutter 8, and the molding machine also includes a top thread mechanism 9, which is arranged on the front side of the threading block 7, which includes a thimble clamp 10, and a thimble 11 fixed on the thimble clamp 10; Send between the front and rear molds 3 and 4 through the threading block 7, the push mechanism 6 ...

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Abstract

The invention relates to a forming machine for a conducting wire of a glass-sealed diode. The forming machine comprises a station, a thread cutting mechanism, a front mold, a rear mold and a ram whichare arranged on the station, a pushing mechanism for driving the components, and a thread ejection mechanism, wherein the front mold and the rear mold can be closed to form a mold cavity; the threadcutting mechanism comprises a threading block provided with a threading hole; an outlet end of the threading block is adjacent to an inlet end of a mold cavity; a cutting knife is arranged at the adjacent position; and the thread ejection mechanism is arranged on the front side of the threading block, and comprises a thimble fixture and a thimble fixed on the thimble fixture. Compared with the prior art, a product produced by the forming machine has higher dimensional precision and smooth surface, completely improves the defects such as clamp marks, scratches, burrs and the like, has a fully smooth incision surface, and not only has qualitative change of the product quality, but also greatly improves the production efficiency from the original 120 counts / min to the current 180 counts / min.

Description

technical field [0001] The invention relates to a diode wire forming machine, in particular to a glass-encapsulated diode wire forming machine. Background technique [0002] Glass-encapsulated diode wires are mainly used in the production of light-emitting diodes and rectifier diodes. It turns out that wire products are molded by wire forming machine clamping dies. The formed products have low dimensional accuracy, rough surface, and defects such as pinch marks, scratches, and burrs, and the production efficiency is not high. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a glass-encapsulated diode wire forming machine in order to overcome the above-mentioned defects in the prior art. [0004] The object of the present invention can be realized through the following technical solutions: a glass-encapsulated diode wire forming machine, including a machine platform, a thread cutting mechanism, a front mold, a rea...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R43/28H01L21/60
CPCH01L2924/0002
Inventor 吕勇逵
Owner 光路新能源材料(上海)有限公司
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