Encapsulating method of colour loop inductance product

Abstract

The invention discloses an encapsulating method of colour loop inductance product, including the step that repeated encapsulating and curing are carried out on magnetic core stack by ultraviolet lightcuring paint UV paint, wherein the magnetic core stack is divided into a body in the middle and groove shape baffle ends with a lead at the two ends of the body, the body is wound with an enameled wire, the initial end of the enameled wire is respectively connected with the leads at the two ends, and complete encapsulating processing is carried out on the groove shape baffle ends at the two endsof the body by the UV paint in a primary encapsulating. The initial end of the enameled wire is respectively welded on the leads at the two ends of the body, and the UV paint also encapsulates a welding spot. The method can reduce pinhole on an encapsulating layer and improve tensile strength of the enameled wire at the welding point.

Description

technical field [0001] The invention relates to a method for encapsulating lead-type electronic components, in particular to a method for encapsulating color ring inductance products. Background technique [0002] At present, most of the encapsulation processes of domestic color-coded inductance products are as follows: first, 2 UV glue encapsulations, and then 3 outer paint encapsulations. This process has been developed for a long time and is relatively mature, but it has the following two shortcomings: (1) For the pinholes and bubbles that occur during the encapsulation process, there has not been a process that can eliminate them. (2) When the product is formed by bending the feet in the customer (especially when the pitch of the bending feet is short), the enameled wire at the solder joint is easy to break due to force, resulting in poor open circuit. [0003] Existing process features: [0004] (1) The encapsulation effect is greatly affected by the on-site environme...

AI Technical Summary

Problems solved by technology

This process has been developed for a long time and the process is relatively mature, but there are two shortcomings: (1) For the pinholes and bubbles that occur during the encapsulation process, there has never been a process that can eliminate them

(2) When the product is formed by bending the feet in the customer (especially when the pitch of the bending feet is short), the enameled wire at the solder joint is easily broken due to force, and there is a poor open circuit

During the season transition (such as April and November each year), the rate of pinholes and air bubbles in the encapsulation process is as high as 3%, resulting in low production efficiency and large losses;

[0005] (2) The promotion of non-halogenation of coatings makes the encapsulation effect not as good as before, and the pinhole and air bubble rate increase;

[0006] (3) The solder joints of a considerable number of products are not completely encapsulated by UV glue, and the tensile strength of the enameled wire at the solder joints is low

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