Sputtering target material and sputtering target obtained by using the sputtering target material
A sputtering target and sputtering target technology, applied in the field of sputtering targets, can solve the problems of reducing arcs, unable to fully suppress target cracks and cracks, etc., so as to reduce the generation of arcs and inhibit the generation of cracks or cracks. , the effect of improving utilization efficiency
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Embodiment 1
[0114] Such as Figure 6 As shown, a nearly plate-shaped ITO sputtering target (SnO 2 =10% by weight, the relative density is 99.8%), the chamfering treatment of R1 was performed on the edge parts 45a-45c, and the chamfering treatment of R1 was performed on the four corners A located on the sputtering surface 2.
[0115] Then, this sputtering target 1 was bonded to a back plate (230×750×20 mm) made of oxygen-free copper using the above-mentioned adhesive material, thereby producing a sputtering target. Using the obtained sputtering target, evaluation was performed on each of the evaluation items described above. The obtained results are shown in Table 1.
Embodiment 2
[0120] The ITO sputtering target composed of the materials shown in Table 1 was manufactured, and the chamfering treatment of C0.3 was implemented on the four corners A of the sputtering surface 2, and the edges and corners of the bonding surface were C0.5 chamfering treatment is implemented on the part.
[0121] Then, in the same manner as in Example 1, a sputtering target was produced, and various evaluations were performed. The obtained results are shown in Table 1.
Embodiment 3~9、 comparative example 3~5
[0126] ITO sputtering targets composed of the materials shown in Table 1 were manufactured, and chamfering was performed on the edges or corners according to the contents shown in Table 1.
[0127] Then, in the same manner as in Example 1, a sputtering target was produced, and various evaluations were performed. The obtained results are shown in Table 1.
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