Preparation method of line heat source
A wire heat source, wire-shaped technology, applied in the direction of heating element material, heating element shape, etc., can solve the problems of complicated carbon fiber paper preparation process, inability to prepare micro wire heat source, and large thickness of carbon fiber paper, etc., and achieves light weight and electric-thermal conversion efficiency. High, small thermal hysteresis effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
preparation example Construction
[0023] see Figure 4 The first embodiment of the technical solution provides a method for preparing a linear heat source 20, which mainly includes the following steps:
[0024] Step 1, providing a linear substrate 202 .
[0025] The linear substrate 202 is used to support the carbon nanotube structure 204, and its material can be a hard material, such as: ceramics, glass, resin, quartz, etc., or a flexible material, such as: plastic or flexible fiber, etc., for making The wire heat source 20 is bent into any shape as required during use. The length, diameter and shape of the linear base 202 are not limited, and can be selected according to actual needs. It can be understood that the material of the linear base 202 is not limited to the materials listed above, as long as it is an insulating material with certain heat resistance. The length, diameter and shape of the linear base 202 are not limited, and can be selected according to actual needs. The preferred linear base 202...
PUM
Property | Measurement | Unit |
---|---|---|
diameter | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com