Electronic component mounting board, method for manufacturing the same and electronic circuit unit

A technology for installing electronic components and conductive components, which is applied in the direction of assembling printed circuits, circuits, and contact components with electric components, which can solve problems such as increased inductance and difficult application of high-frequency electronic components, and achieves the reduction of electrode intervals and shortened conduction. through part, the effect of reducing inductance

Inactive Publication Date: 2011-10-05
THE FUJIKURA CABLE WORKS LTD
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, in the case of reducing the terminal pitch, it is necessary to make the leaf spring thinner
Therefore, since the inductance increases in any case, it is difficult to apply to high-frequency electronic parts

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic component mounting board, method for manufacturing the same and electronic circuit unit
  • Electronic component mounting board, method for manufacturing the same and electronic circuit unit
  • Electronic component mounting board, method for manufacturing the same and electronic circuit unit

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0068] Hereinafter, the present invention will be described in detail with reference to the drawings, but the present invention is not limited thereto, and various changes can be made without departing from the gist of the present invention.

[0069] Figure 1A , 1B It is a figure which schematically shows 1st Embodiment of the board|substrate 10 (10A) for mounting electronic components of this invention. Figure 1A is a top view, Figure 1B yes Figure 1A The L-L section diagram.

[0070] The electronic component mounting substrate 10A of the present invention is roughly composed of the following components: a base 1, which is made of a flat elastic body, and has a plurality of through holes 2 arranged in parallel at predetermined intervals; a conductive member 3, which It is arranged so that the main body portion 3c is filled in the through hole 2, and has a first protruding portion 3a and a second protruding portion 3b at one end and the other end respectively, the firs...

no. 2 approach

[0097] Figure 7A , 7B It is a figure which schematically shows the board|substrate 10 (10B) for electronic component mountings concerning 2nd Embodiment of this invention. The same symbols are assigned to the same parts as those in the first embodiment, and their descriptions are omitted. Figure 7A is a top view, Figure 7B yes Figure 7A The L-L section diagram. This embodiment differs from the first embodiment in that a slit 9 is arranged on the substrate 4 along the shape of the other end 5 f of the electrode 5 .

[0098] The slit 9 has only to be arranged so as to surround at least the outer periphery of the electrode 5 on the side of the one end 5 f. The slit 9 increases the stroke amount of the electrode 5, and when the electronic component 60 is mounted in the same manner as the first embodiment, it is possible to further absorb the variation in the height of the solder bump α. Therefore, the contact pressure of the electrode 5 with the solder bump α of the elec...

no. 3 approach

[0101] Figure 8A , 8B It is a figure which schematically shows the board|substrate 10 (10C) for electronic component mountings concerning 3rd Embodiment of this invention. The same symbols are assigned to the same parts as in the second embodiment, and their descriptions are omitted. Figure 8A is a top view, Figure 8B yes Figure 8A The L-L section diagram. This embodiment differs from the second embodiment in that structures 6 ( 6 a , 6 b ) are arranged on both surfaces 1 a , 1 b of a base 1 .

[0102] By providing substrates 4 (4a, 4b) with electrodes 5 (5a, 5b) arranged on both surfaces 1a, 1b of the base body 1, that is, structures 6 (6a, 6b) as in this embodiment, it is possible to mount electronic components. At the same time, height deviations are more effectively absorbed on both sides of the base body 1 . Therefore, the electronic components 60 or the circuit board 70 having different heights can be mounted on both sides, and the electronic circuit components...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The present invention relates to an electronic component mounting board, a method for manufacturing the same and an electronic circuit unit. The electronic component mounting board includes: a substrate base made of a flat-plate-like elastic body, the substrate base having a plurality of through-holes in a manner spaced a predetermined distance apart from each other; conductive members, each of which has a main unit portion filled in the through-hole, the main unit portion having a first protrusion portion and a second protrusion portion respectively on a first end and a second end thereof, with the first protrusion portion arranged so as to protrude from a first surface of the substrate base and the second protrusion portion arranged so as to protrude from a second surface of the substrate base; a flexible substrate that is arranged on the first surface of the substrate base and that has first opening portions for penetration of the first protrusion portions; and a plurality of oval electrodes arranged on the substrate, each of which has a second opening portion for penetration of the first protrusion portion, in which the electrodes are arranged in a manner spaced apart from each other, and each of the second opening portions is formed on a first end side of each of the electrodes.

Description

[0001] This application claims priority based on Japanese Patent Application No. 2008-079587 for which it applied to Japan on March 26, 2008, and Japanese Patent Application No. 2008-095019 for which it applied to Japan on April 1, 2008, and uses them here. technical field [0002] The present invention relates to a substrate for mounting electronic components. More specifically, the present invention relates to a substrate for mounting electronic components capable of ensuring sufficient contact pressure regardless of height variations of electronic components and capable of reducing on-resistance and inductance, and manufacturing thereof A method, and an electronic circuit component having the electronic component mounting substrate. Background technique [0003] Conventionally, as a method of mounting electronic components on circuit boards with different electrode heights, for example, a method using anisotropic conductive elasticity described in JP-A-11-214594 (hereinaft...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H01R13/02H01R13/11H01R13/24H01R4/18H05K3/32
CPCH01L2224/16225
Inventor 石井裕直江邦浩
Owner THE FUJIKURA CABLE WORKS LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap