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Stable adhesives from urea-denatured soy flour

A technology of soybean flour and adhesives, which is applied in adhesive types, protein adhesives, adhesives, etc., can solve the problems of lack of hydrolytic stability of the polymer skeleton, and achieve high tolerance, excellent biological resistance, Effects that are easy to transfer and apply

Inactive Publication Date: 2012-09-05
SOLENIS TECH CAYMAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

While these resins are very strong, fast curing and fairly easy to work with, they lack hydrolytic stability along the polymer backbone

Method used

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  • Stable adhesives from urea-denatured soy flour
  • Stable adhesives from urea-denatured soy flour
  • Stable adhesives from urea-denatured soy flour

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0090] Soy flour is heat denatured and then reacted with urea to produce a stable soy / urea aqueous product (SUP). The method of embodiment 1A and 1C is identical, and difference is only the consumption of various raw materials. Example 1D is similar to 1B except that the temperature used is different (D-50°C, B-90°C), and Example D also uses low urease roasted soybeans (CG4).

[0091] Preparation method: Add water to a three-neck round bottom flask equipped with a heating mantle, temperature controller, reflux condenser and mechanical stirrer. Soy flour was added to the water over a period of 2-5 minutes at room temperature. The mixture was stirred for 5 minutes until homogeneous and then heated to 90° C. over 5-30 minutes. While stirring, the reaction was held at 90°C ± 2°C for 1 hour at which time urea was added to the urease-free soybeans and the reaction was reheated to 90°C and held at 90°C ± 2°C for 1 hour while stirring. The reaction was cooled to 25°C on an ice / wate...

Embodiment 2

[0107] Embodiment 2: comparative example

[0108] Some recent work has demonstrated the known dry and wet adhesive strengths of non-crosslinked soy protein isolates. A comparison of these binders with the binders of the present invention shows that improvements can be achieved with low cost, high sugar content soy flour.

[0109] Example 2A is a low temperature urea-denatured product prepared as described by Sun, except using 23.9% solids instead of 14.0%. In addition, Sun's product was lyophilized and the product of the present invention was used directly.

[0110] Preparation method: Add water and urea to a three-neck round bottom flask equipped with a heating mantle, temperature controller, reflux condenser and mechanical stirrer. The solution was heated to 25°C, at which point SPI was added over a period of 15 minutes. While stirring, the mixture was maintained at 25°C ± 2°C for 1 hour. The reaction product was then stored at room temperature until use.

[0111] t...

Embodiment 3

[0129] Preparation method: The product prepared according to the method shown in 1B was added to a three-neck round bottom flask equipped with a mechanical stirrer. Add 50% H at room temperature while stirring 2 SO 4 to lower the pH. After the acid addition, the solution was stirred for 15 minutes and then stored at room temperature until use.

[0130] Example 3A was placed in a beaker and the required amount of PAE was added while stirring. Examples 3B and 3C were prepared using the same method. These samples were stirred vigorously for 1 minute until homogeneous and then stored at room temperature until use.

[0131] Table 8

[0132] Formulation of Example 3A (pH 4.5, 0% PAE)

[0133] order

Element

amount (g)

solid

Soy / urea

percentage of

01

similar to example

1B

200.0

60.0

02

50%H 2 SO 4

2.8

1.4

2.3

Total

202.8

61.4

...

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PUM

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Abstract

The present invention provides an improved method of producing a stable urea-denatured soy flour-based adhesive having improved wet and dry strengths, with more efficient production and lower production costs. The method comprises heating soy flour until denatured and then adding urea to the denatured soy flour. The soy flour may be heated up to 40 DEG C to 100 DEG C for at least 15 to 500 minutes. Optionally, the method may also include adding a cross-linking agent to the soy flour / urea mixture and / or adding an emulsified or dispersed polymer. Adhesives prepared according to this inventionoffer increased stability and strength properties.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to US Provisional Patent Application 60 / 831,650, filed July 18, 2006, and US Provisional Patent Application 60 / 835,042, filed August 2, 2006, both of which are incorporated herein by reference. [0003] Statement Regarding Federally Funded Research or Development [0004] none field of invention [0005] The present invention generally relates to methods of making stabilized soy / urea products (SUP) from urea-denatured soy flour and stabilized soy / urea products (SUPD) containing dispersed or emulsified polymers. Background technique [0006] Adhesives derived from protein-containing soybean flour first entered general use in the 1920s (US Patents 1,813,387, 1,724,695, and 1,994,050). Soy flour suitable for use in adhesives has been and is made by removing some or most of the oil from the soybeans, resulting in a soy flour residue, which is then ground into a very fine soy flour. Typic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08K3/28C09J189/00
Inventor J·M·威斯克特M·J·伯克兰
Owner SOLENIS TECH CAYMAN
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