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Lead-free solder for aluminum soft soldering

A lead-free solder, aluminum soldering technology, used in welding/cutting media/materials, welding media, welding equipment, etc., can solve the problem of less reporting, and achieve the effects of good wetting performance, good joint performance, and low cost

Inactive Publication Date: 2009-07-22
YIK SHING TAT INDUSTRIALCO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the research on Sn-Zn solder alloys is based on Cu substrates, and the research on Sn-Zn solder alloys suitable for aluminum soldering is rarely reported.

Method used

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  • Lead-free solder for aluminum soft soldering

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Experimental program
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Effect test

Embodiment 1

[0010] The lead-free solder of this embodiment is composed of the following components by weight percentage: Zn content 9%, Al content 0.5%, Ag content 0.1%, Bi content 1%, and Sn as the balance.

Embodiment 2

[0012] The lead-free solder of this embodiment is composed of the following components by weight percentage: Zn content 9%, Al content 0.5%, Bi content 1%, Sn as the balance.

Embodiment 3

[0014] The lead-free solder of this embodiment is composed of the following components by weight percentage: Zn content 9%, Al content 0.5%, Bi content 2%, Sn as the balance.

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PUM

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Abstract

The invention discloses low-temperature brazing solder for aluminum substrate materials. The solder is leadless solder; and not only the solidified structure is improved compared with needle zinc-phase tin-zinc eutectic alloy and the wettability is improved but also the solder can form joints with higher strength with aluminum substrates. The low-temperature brazing solder for the aluminum substrate materials comprises the following chemical compositions in percentage by weight: 9 to 15 percent of zinc, 0.01 to 2 percent of aluminum, 0.01 to 2 percent of silver, 1 to 3 percent of bismuth, and the balance being tin. The leadless solder alloy obtained by the proposal does not use toxic lead, has stronger antioxidation and better wettability compared with the prior Sn-Zn alloy, and is more suitable for aluminum soft soldering compared with the prior Sn-Ag-Cu solder alloy; and the joints have better performance and lower cost.

Description

technical field [0001] The invention relates to a solder composition, in particular to a lead-free solder composition for aluminum soldering. Background technique [0002] Aluminum and its alloys have the advantages of low density, excellent thermal and electrical conductivity, and low cost. They are used more and more widely in the electronics industry, especially as radiators for electronic products with high power and high calorific value. However, a dense oxide film is easily formed on the surface of aluminum, which makes aluminum soldering difficult to achieve compared with copper soldering, and requires the use of more active and more reactive fluxes. Foreign related aluminum soldering fluxes have applied for some patents, and the currently used solders for aluminum soldering are Sn-Pb, Sn-Ag-Cu, and Sn-Zn. As we all know, Pb is a toxic element. According to the "Administrative Measures for Pollution Control of Electronic Information Products" jointly issued by the Mi...

Claims

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Application Information

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IPC IPC(8): B23K35/26
Inventor 冼健威张新平马鑫吴建雄徐金华
Owner YIK SHING TAT INDUSTRIALCO LTD
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