Cooling control system and cooling control method

Abstract

The invention discloses a heat radiation control system and a heat radiation control method thereof, which is applied to cooling control of a heating element. By utilizing a thermoelectric module to mutually contact with the heating element and utilizing a control module to sense the temperature of the heating element, signals are sent to lead the thermoelectric module to cool the heating element when the heating element acts to lead the temperature of the heating element to increase to an preset temperature upper limit value, on the contrary, if the temperature of the heating element is lower than a preset lower limit value, heat generated by actions of the heating element is converted into electric power to be stored, thereby energy utilizing efficiency and heat radiation efficiency of the heating element can be increased relatively to prolong the service life of the heating element.

Description

technical field [0001] The present invention relates to a heat dissipation control system and a heat dissipation control method thereof, more specifically, to a heat dissipation control system and a heat dissipation control method applied to cooling heating elements. Background technique [0002] According to the light emitting mechanism of a general light emitting diode (Light Emitting Diode), it mainly relies on the combination of electron holes on the semiconductor P-N interface to excite light energy through the luminescent material. However, not every combination of electron holes can completely convert electrical energy into light. According to the photoelectric conversion efficiency of the current light-emitting elements, only about 40% can be converted into useful light sources, in other words, about 60% of the electric energy will be released as unusable heat energy. [0003] Because semiconductor materials (such as: ceramic materials) generally have excellent therm...

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Problems solved by technology

Among them, the micro-duct water cooling technology and the Joule-Townsom element cooling technology are still in the experimental certification stage and the manufacturing process is difficult and expensive, so it is difficult to be widely used in a short period of time and does not have market economic value.

The semiconductor refrigeration technology mainly includes thermoelectric refrigeration, thermionic field emission (Field Emission) refrigeration, and standard electron tunneling (Standard Electronics Tunneling) refrigeration. Although the latter two are powerful, they are still in the experimental development stage. But it has not yet reached the practical economic value, so it will not be repeated here.

[0006] The refrigeration principle in thermoelectric refrigeration technology is mainly based on the Peltier Effect (Peltier Effect) and the Seeback Effect (Seeback Effect) to explain the physical phenomenon of current generating temperature difference or temperature difference generating current from different angles, that is, using a cold guide plate and a heat guide plate to exchange heat with each other to achieve the effect of heat dissipation. Because the thermoelectric device has small size, long life, no noise, no need to use refrigerant (no environmental pollution), and can be used upside down or sideways (no direction restriction), extremely Low maintenance cost and other advantages, so it is widely used in the industry at present, but its cost is still higher than that of air-cooled heat dissipation modules, and the energy conversion efficiency is low (about 40-50%)

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