Radiator structure

Abstract

The invention relates to a radiator structure which is arranged in an electronic device and is used for exchanging heat with an electronic component of the electronic device. The radiator structure comprises a contact socket and a fin socket, wherein the contact socket is clung on the electronic component for the heat transmission. The fin socket is pivoted on the contact socket so as to transmit heat with the contact socket, the fin socket is provided with a plurality of radiating fins and can rotate opposite to the contact socket through using a rotating shaft as the axes, and the gravity center of the fin socket is offset outside the rotating shaft. When electronic device is moved, the fin socket rotates because of the offset gravity center and causes the radiating fins to disturb air at the inner part of the electronic device.

Description

technical field [0001] The invention relates to a radiator structure, in particular to a radiator structure applied to portable electronic devices. Background technique [0002] With the rapid development of electronic technology and consumers' increasing emphasis on the lightness and portability of consumer electronic products, today's electronic products, such as notebook computers, ultra mobile personal computers (UMPC), PDA and other portable Electronic devices have been gradually miniaturized. For users who need to go out frequently, portable electronic products have become easier to carry, greatly improving the convenience of use. [0003] Due to the fast calculation speed of the electronic devices inside the computer device, coupled with the small size of the electronic devices, the calorific value per unit area will increase accordingly. If the heat energy is not dissipated in time, the high temperature will seriously affect the electronic devices. Stability and eff...

AI Technical Summary

Problems solved by technology

[0008] The object of the present invention is to provide a heat sink structure to improve the known heat dissipation devices used in portable electronic devices, which must cooperate with the internal circuit wiring of the electronic device, and cannot use fans to dissipate heat, only through the surface of the heat sink and the air contact, and dissipate heat by natural convection, resulting in poor overall cooling performance

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