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Heating resistor element, manufacturing method for the same, thermal head, and printer

A heating resistor and heating resistor technology, applied in printing and other directions, can solve the problems of large differences in thermal expansion coefficient, expensive material processing, and reduced printing quality, and achieve the effects of high printing performance, low cost, and reduced power consumption

Inactive Publication Date: 2009-04-29
SEIKO INSTR INC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] That is, in the case of using cheap soda glass, the difference in thermal expansion coefficient between the silicon substrate and the thin plate glass is large (silicon substrate: 3.3×10 -6 / ℃, soda glass: 8.6×10 -6 / °C), therefore, warpage or deformation occurs in the heating resistor element after the bonding step or when used as a thermal head, which changes the contact with the thermal paper, degrading the print quality
[0006] On the contrary, because Pyrex (registered trademark) glass has approximately the same thermal expansion coefficient (3.2×10 -6 / °C), so the above-mentioned disadvantages are difficult to occur, but the problem is that the material is expensive and its processability is poor

Method used

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  • Heating resistor element, manufacturing method for the same, thermal head, and printer
  • Heating resistor element, manufacturing method for the same, thermal head, and printer
  • Heating resistor element, manufacturing method for the same, thermal head, and printer

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Embodiment Construction

[0040] The heating resistance element 1 and its manufacturing method, thermal head 2 and thermal printer (printer) 3 according to an embodiment of the present invention are described below with reference to FIGS. Figure 7 to describe.

[0041] The heating resistance element 1 according to this embodiment is used in a thermal head 2 of a thermal printer 3 shown in FIG. 1 .

[0042] The thermal printer 3 includes a body frame 4, a platen roller 5 arranged horizontally, a thermal head 2 arranged to face the outer periphery of the platen roller 5, and a thermal head 2 between the platen roller 5 and the heat sensitive printer. A paper feeding mechanism 7 for feeding thermal paper 6 between the heads 2, and a pressing mechanism 8 for pressing the thermal head 2 against the thermal paper 6 with a predetermined pressing force.

[0043] The thermal head 2 is formed in a flat plate shape as shown in the front view of FIG. 2, and includes a plurality of heating resistance elements 1 s...

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Abstract

Provided is a heating resistor element including: an insulating substrate including a glass material; a heat accumulating layer bonded to the insulating substrate through heating to temperature ranging from an annealing point to a softening point in a state of being adhered to a surface of the insulating substrate, and including the same material as the glass material of the insulating substrate; and a heating resistor provided on the heat accumulating layer, in which, on at least one of bonded surfaces between the insulating substrate and the heat accumulating layer, at least one of the insulating substrate and the heat accumulating layer is provided with a concave portion in a region opposed to the heating resistor to form a hollow portion. Accordingly, deformation caused by a difference in coefficient of thermal expansion is suppressed to improve printing quality.

Description

technical field [0001] The invention relates to a heating resistance element, a manufacturing method thereof, a thermal head and a printer. Background technique [0002] Generally, in a heating resistor element provided in a thermal head of a printer, in order to improve the heating efficiency of the heating resistor and reduce power consumption, a hollow portion is formed in a region opposite to the heating resistor, and the hollow portion is used as a A thermal insulation layer of low thermal conductivity, thereby controlling the heat flow from the heating resistor to the side of the isolated substrate (see eg JP 2007-83532A). [0003] As a method of forming the hollow portion, a method is employed in which a silicon substrate is subjected to etching or laser processing, and a recessed portion (having a depth of 1 μm or more and 100 μm or less) is formed by performing the hollow portion at 700° C. or lower. The anodic bonding (anodic bonding) of ® has bonded thereto a thi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41J2/335
Inventor 顷石圭太郎师冈利光东海林法宜佐藤义则三本木法光
Owner SEIKO INSTR INC
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