Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

System and method for testing characteristic impedance of circuit board

A characteristic impedance and test system technology, applied in the direction of measuring resistance/reactance/impedance, measuring devices, measuring electrical variables, etc., can solve the problems of slow test speed, high cost, complicated operation, etc., to simplify manual operation steps and reduce damage Probability, the effect of reducing the difficulty of operation

Active Publication Date: 2009-04-22
UNIV OF ELECTRONICS SCI & TECH OF CHINA +1
View PDF0 Cites 17 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This kind of test equipment has several disadvantages, such as: complicated operation, high cost, slow test speed, the instrument is easily damaged by electrostatic breakdown, and has harsh requirements on the test working environment, etc.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • System and method for testing characteristic impedance of circuit board
  • System and method for testing characteristic impedance of circuit board
  • System and method for testing characteristic impedance of circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] In order to facilitate the understanding of those skilled in the art, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments:

[0036] Such as figure 1 The circuit board characteristic impedance test system includes a test host 100, a probe 103 plugged into the test host, a PC 101, and a printer 102 connected to the PC. The test host includes a pulse generating circuit 205, a coaxial switch 206, a pulse receiving circuit 209, a signal acquisition module, a logic control module 202, and a CPU processing module 101.

[0037] The pulse generating circuit 205, which is connected to the logic control module 202, is used to generate an excitation step pulse signal. When the line under test is connected to start the test, the high-speed step pulse signal propagates along the line under test and reflects when it encounters impedance discontinuities. In this system, the rising time range of the rising edge of the ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a system and a method which can rapidly test the characteristic impedance of a printed circuit board. The system comprises a test host, a probe, a PC machine, a printer and analysis software which is operated on the PC machine. The test host comprises a pulse generating circuit, a pulse receiving circuit, a coaxial switch, a signal acquisition module, a logic control module and a CPU processing module. The system adopts the intelligent and automatic design, a user can automatically test, display the result, and the like, by only carrying out the simple initialization settings through the combination with the test method, thereby simplifying the manual operation steps and reducing the operation difficulty. An output end in the system adopts the coaxial switch to carry out the switch, the differential impedance test can be realized by using the single step pulse transmission and a single receiving channel, thereby avoiding the error problem caused by adopting two step pulse generating circuits or two receiving channels which are not fully consistent, effectively improve the test precision and simultaneously reducing the probability of damaging the test host by the external static electricity.

Description

Technical field [0001] The invention relates to a system and method capable of quickly testing the characteristic impedance of a printed circuit board. Background technique [0002] In recent years, with the rapid development of electronic products such as desktop computers (PC), notebook computers, mobile phones, digital TVs, set-top boxes, consumer electronics (MP3, MP4, game consoles, digital cameras, etc.), communication equipment, and automotive electronics, The signal transmission frequency and speed are getting higher and higher, and strict characteristic impedance test requirements are put forward for the used circuit board (PCB). [0003] The characteristic impedance of the PCB board circuit is related to the physical size of the circuit on the board, PCB manufacturing material, processing technology, etc., and the characteristic impedance of each batch of circuit boards may be different. In order to control the line impedance, PCB manufacturers need to conduct strict ch...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G01R27/04
Inventor 曹勇徐地华秦开宇梅领亮周振兴雷英俊安玉娟李颖曾纪瑞连丰庆翟鹏陈伯平王天辉梁前吴伟钦王巍
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com