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Containment of a number of electronic components with suction channels with a pneumatic adjustment element

A technology for electronic components and pneumatic adjustment, applied in the manufacturing of electrical components, electrical components, semiconductor/solid-state devices, etc., can solve the problems of increasing suction air consumption, high operating costs, etc., and achieve the effect of improving efficiency

Inactive Publication Date: 2009-04-15
SIEMENS ELECTRONICS ASSEMBLY SYST LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of this method is that openings are exposed in regions of the vacuum pick-up device in which no components rest against the suction surface
As a result, the consumption of suction air is increased by the air flow at the exposed opening that is not used for holding the components
On the other hand this leads to high operating costs

Method used

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  • Containment of a number of electronic components with suction channels with a pneumatic adjustment element
  • Containment of a number of electronic components with suction channels with a pneumatic adjustment element
  • Containment of a number of electronic components with suction channels with a pneumatic adjustment element

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Embodiment Construction

[0037] It should be pointed out here that the designations of identical or mutually corresponding components in the figures differ only in their first numerals.

[0038] FIG. 1 a shows a pneumatic component picking device 100 according to a preferred embodiment of the invention in a cross-sectional view. The device has a base part 110 in which a plurality of suction channels 112 are formed. The suction channel 112 extends from a planar front face 115 of the base part 110 to a likewise planar rear face 116 of the base part.

[0039] In the middle of the base part 110 , the suction channels 112 each have a widening, on which a pneumatic adjustment part 120 is arranged, which is displaceable in the vertical direction. A possible movement of the pneumatic adjustment part 120 is indicated by a double arrow 121 .

[0040] The pneumatic adjustment elements 120 are each held in a starting position by a spring element 122 . In this starting position the suction channel is open, ie a...

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Abstract

A device for simultaneous accommodation of electronic components. The devie is specifically use for accommodation of a plurality of semiconductor chips from a chip unit. The chip unit has a support film and a semiconductor chip attached to the support film. The device has a base unit with multiple suction channels that extend from a front side of the base unit to a rear side of the base unit. Multiple pneumatic adjustment units i.e. passive components, are assigned to the respective suction channels. Each adjustment unit is equipped such that an air flow through the respective suction channel is partially blocked when the strength of the air flow exceeds a predetermined threshold value. An independent claim is also included for a method for simultaneous accommodation of electronic components. The method adopts the component accommodation deivce.

Description

technical field [0001] The invention relates to the field of processing electronic components, in particular semiconductor chips, which are attached to an adhesive support film of a wafer arrangement after a sorting process from already processed wafers. In particular, the invention relates to a device and a method for simultaneously picking up a plurality of electronic components or semiconductor chips from a wafer arrangement having a carrier film and the components or semiconductor chips attached to the carrier film. Background technique [0002] Due to the increasing miniaturization of electronic components, it will no longer be economical in the near future to repack electronic components that should be mounted on electronic circuit substrates in order to reliably supply the components during assembly. This repacking is often used on special component infeed tapes to supply components individually to the assembly process. Modern SMT assembly systems are even more deman...

Claims

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Application Information

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IPC IPC(8): H01L21/683H05K13/02H05K13/04
CPCH01L21/67144H01L21/68778H01L21/67132H01L21/68714H01L21/6838
Inventor 蒂洛·布兰迪斯克里斯蒂安·弗里克丹尼尔·特雷贝斯
Owner SIEMENS ELECTRONICS ASSEMBLY SYST LLC
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