Processing system for process object and thermal processing method for process object

Abstract

The present invention provides a processing system for a process object capable of preventing a transport arm mechanism from being thermally damaged, so as to effectively perform a transport operation of the process object. A processing system 2, which takes out a process object W from a storage box 6 for process object, and thermally process the process object, includes: a vertical processing unit 24; a process-object transport area 10 disposed below the processing unit; a plurality of process-object boats 20 configured to hold the process objects; a boat elevating means 68 configured to vertically move the process-object boat 20; a boat table for transport 52, on which the process-object boat can be placed; and a transport arm mechanism configured to transport the process objects between the storage box 6 and the process-object boat 20 placed on the boat table for transport 52. The transport arm mechanism 56 is vertically moved by an arm elevating means 58. A temperature measuring means 86 is disposed in an upper part in the process-object transport area. The transport arm mechanism 58 and the arm elevating means 58 are controlled by a transport control part 88 based on a measured value of the temperature measuring means 86, so that a transport operation of the transport arm mechanism is controlled.

Description

[0001] technology area [0002] The present invention relates to a processing system for transferring an object to be processed from a storage box containing a semiconductor wafer or the like to an object carrier in an object transfer area for heat treatment of the object to be processed and an object to be processed Body heat treatment method. Background technique [0003] Generally, in order to manufacture semiconductor integrated circuits such as ICs and LSIs, various film formation processes, oxidation diffusion processes, and etching processes are repeatedly performed on semiconductor wafers. When performing various processes, semiconductor wafers need to be transported between corresponding devices. In this case, a plurality of semiconductor wafers, for example, 25 semiconductor wafers are stored and transported in the storage box at a time. As such a storage box, known is: a storage box that is transported in an open state relative to atmospheric treatment like a box, ...

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Problems solved by technology

[0015] However, in this case, the retreat time for retracting the above-mentioned transfer arm mechanism is generally a long time from the start of unloading to the completion of unloading and the position where the upper part of the object transfer area is sufficiently cooled by the ambient temperature.

Therefore, for example, although the upper part of the atmosphere temperature in the target object transfer area is lowered to a safe temperature for the above-mentioned members constituting the transfer arm mechanism, there is a state in which the transfer operation of the wafer remains prohibited, thus causing production failure. volume reduction problem

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