Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Precleaning method of reaction system

A reaction system and pre-cleaning technology, applied in cleaning methods and utensils, cleaning methods using gas flow, chemical instruments and methods, etc., can solve problems such as difficulty in ensuring pre-cleaning effect, complicated operation, etc., and achieve enhanced particle removal effect. , Enhance the effect of particle peeling, and save the effect of continuous time

Inactive Publication Date: 2010-06-09
SEMICON MFG INT (SHANGHAI) CORP +1
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the above-mentioned charging stage is used to set and read environmental parameters and self-calibration and confirmation of the machine, the discharge stage is used to restore the environmental state, such as exhaust, cooling, etc.; that is The above method is to pre-clean the reaction system during the adjustment stage of the machine, which is difficult to ensure the pre-cleaning effect and easily leads to complicated operations.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Precleaning method of reaction system
  • Precleaning method of reaction system
  • Precleaning method of reaction system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] Although the invention will be described in more detail below with reference to the accompanying drawings, in which preferred embodiments of the invention are shown, it should be understood that those skilled in the art can modify the invention described herein and still achieve the advantageous effects of the invention. Therefore, the following description should be understood as a broad instruction for those skilled in the art, rather than as a limitation of the present invention.

[0026] In the interest of clarity, not all features of an actual implementation are described. In the following description, well-known functions and constructions are not described in detail since they would obscure the invention with unnecessary detail. It should be appreciated that in the development of any actual embodiment, numerous implementation details must be worked out to achieve the developer's specific goals, such as changing from one embodiment to another in accordance with sy...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Disclosed is a pre-cleaning method of a reaction system, comprising: confirming a cooling region taking a first temperature and a second temperature as boundary values, wherein, the first temperatureis higher than the second temperature; executing the pretreatment operation so as to make the temperature in the reaction system be the first temperature; executing the cooling operation from the first temperature to the second temperature; beginning to execute the vacuum pumping operation in the cooling process; executing the air suction and heating-up operation after the temperature is reduced to the second temperature so as to make the temperature in the reaction system be the reaction temperature at least. The invention can reduce the pre-cleaning time to improve the production efficiency,and can also enhance the micro-particle removing effect.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a method for pre-cleaning a reaction system. Background technique [0002] The silicon wafer heat treatment process involved in the semiconductor process requires a wide range of application of various reaction systems, such as deposition reaction systems, etching reaction systems, and oxidation systems. In practice, after the heat treatment operation is completed, a film layer with a certain thickness and distribution and particles on it usually remain on the wall of the reaction system. After undergoing a heat treatment process, the particles are prone to exfoliation. The exfoliated particles will travel with the air and lodge on the wafer, causing defects and lower yields. Therefore, in actual production, in order to reduce particles, nitrogen (N 2 ) Periodically pre-clean the reaction system. [0003] Such as figure 1 As shown, the step of pre-cleanin...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B08B7/00B08B7/04B08B5/04H01L21/00
Inventor 朴松源何有丰白杰唐兆云
Owner SEMICON MFG INT (SHANGHAI) CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com