Surface-mounted contraposition apparatus and method thereof

Abstract

The invention relates to a surface mounting contraposition method, comprising: using a first image sensing device to sense a profile image of an electronic device, and using a central control processing device to obtain geometry center coordinate of the electronic device; using a second image sensing device to sense a profile image of a pad of a printed circuit board, and using the central control processing device to obtain geometry center coordinate of the pad; moving a pickup patch device to pick up the electronic device to perform contraposition patch, thereby realizing correct automatic contraposition patch of the electronic device in large size, effectively advancing efficiency and accuracy of the surface mounting contraposition patch of the electronic device in large size. The invention also relates to a surface mounting contraposition device.

Description

technical field [0001] The invention relates to surface mount technology, in particular to a surface mount alignment device and an alignment method thereof. Background technique [0002] Surface Mount Technology (SMT) has been widely used in the assembly of electronic components and printed circuit boards due to its high reliability and ease of automation. [0003] At present, electronic components can use automatic placement equipment to realize automatic alignment and placement of electronic components and pads of printed circuit boards, so as to achieve accurate surface mounting. See literature Capson, D.W.; Tsang, R.M.C, Automatic visual measurement of surface-mount device placement, Robotics and Automation, IEEE Transactions on, 1990, 6(1), 44-52. Automatic placement equipment usually has a visual alignment system. During the automatic surface mounting process of electronic components and printed circuit boards, the image sensor device of the visual alignment system, s...

AI Technical Summary

Problems solved by technology

[0004] However, the image sensor device of the vision alignment system usually has a field of view of only 50mm×50mm

Due to the limitation of the field of view, the image sensor device usually can only directly obtain the entire image coordinates of electronic components of small size (size less than 50mm×50mm), so it can only realize automatic alignment of small-sized electronic components piece

When the size of the electronic components to be mounted is large, such as a connector part (Connector) with a size of 62mm×6mm, since this size has exceeded the field of view of the image sensor device of the vision alignment system, it cannot be accurately placed. Obtain the entire image coordinates of electronic components, making it impossible to achieve accurate automatic alignment and placement

Therefore, at present, the alignment placement of large-sized electronic components usually needs to be done manually, which not only consumes more manpower and time, but also easily causes artificial alignment errors during the alignment placement process, thus affecting the waiting time. Surface Mount Quality of Mounted Electronic Components

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