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Backing board for laminating covered copper plate

A technology of copper clad laminate and backing plate, applied in the direction of lamination, lamination device, press, etc., can solve the problems of thinning thickness, unqualified products, etc., to reduce the thickness difference, excellent buffer, and improve the thickness qualification rate. Effect

Inactive Publication Date: 2008-08-13
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Conventional cushioning materials require good thickness uniformity. The thickness tolerance of the entire board surface is required to be: the central value of the thickness is ±5%, and the cushioning material needs to have a certain degree of elasticity. Under a certain pressure, the thickness of the cushioning material will become thinner. , after the pressure is removed, the thickness of the cushioning material is restored or partially restored to its original state, and the product is unqualified

Method used

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  • Backing board for laminating covered copper plate
  • Backing board for laminating covered copper plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] See Figure 3. During the processing of copper clad laminates, the greater the pressure on the board surface, the greater the glue flow of the bonding sheet. The size of the glue flow of the bonding sheet can be controlled by changing the pressure on each part of the board surface. , reduce the flow of glue on the edge of the board to increase the thickness of the edge of the board, reduce the thickness difference between the edge of the board and the middle of the board, and ensure the uniformity of the thickness of the entire effective area of ​​the copper clad laminate. And changing the pressure distribution on the plate surface can be realized by changing the thickness distribution of the cushioning material. A buffer material for copper clad laminates, including a square buffer material substrate 1, the thickness of the substrate 1 linearly decreases from the middle to the periphery according to a linear function, such as decreasing according to Y=2(1-X), where Y is...

Embodiment 2

[0024] See Figure 4. During the processing of copper clad laminates, the greater the pressure on the board surface, the greater the glue flow of the bonding sheet. The size of the glue flow of the bonding sheet can be controlled by changing the pressure of each part of the board surface. , reduce the flow of glue on the edge of the board to increase the thickness of the edge of the board, reduce the thickness difference between the edge of the board and the middle of the board, and ensure the uniformity of the thickness of the entire effective area of ​​the copper clad laminate. And changing the pressure distribution on the plate surface can be realized by changing the thickness distribution of the cushioning material. A buffer material for lamination of copper clad laminates, comprising a cuboid buffer material matrix 1, the thickness of the matrix 1 decreases stepwise from the middle to the periphery, and the decreasing range is 30% of the matrix. When every step is reduced,...

Embodiment 3

[0026] See Figure 5. During the processing of copper clad laminates, the greater the pressure on the board surface, the greater the glue flow of the bonding sheet. The size of the glue flow of the bonding sheet can be controlled by changing the pressure of each part of the board surface. , reduce the flow of glue on the edge of the board to increase the thickness of the edge of the board, reduce the thickness difference between the edge of the board and the middle of the board, and ensure the uniformity of the thickness of the entire effective area of ​​the copper clad laminate. And changing the pressure distribution on the plate surface can be realized by changing the thickness distribution of the cushioning material. A buffer material for copper clad laminates, including a cuboid buffer material substrate 1, the thickness of the substrate 1 decreases in a non-step manner from the middle to the periphery, and the decreasing range is 50% of the substrate. The buffer material is...

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Abstract

The invention belongs to electronic material technology, and specially relates to a base plate used for copper clad laminating. The thickness of a basic body decreases gradually from the middle to the periphery, and the declining rate is from 5% to 50%, linear, stepped or not stepped. The basic body is cube, rectangular or cylindrical, and felt fabric pressed by heat-resistant fiber fabric and heat-resistant material. The plate can change the pressure field structure when laminating the copper clad, thereby forming a great central pressure and a smaller pressure on the edges, then changing the gummy property when laminating the copper clad, reducing the gum with a low pressure on the edges, and enhancing the percent of thickness pass of the product.

Description

Technical field: [0001] The invention belongs to the technical field of electronic materials, in particular to a backing plate for laminating copper-clad laminates. Background technique: [0002] Copper-clad laminate is a composite material made by impregnating the reinforcing material with resin, covered with copper foil on one or both sides, and hot-pressed, referred to as copper-clad laminate (CCL), which is used to make printed circuit boards (PCB) . Printed circuit boards have become an indispensable main component for most electronic products to achieve circuit interconnection. [0003] During the processing of copper clad laminates, the reinforcing material (such as glass fiber cloth) is impregnated with resin, and heated in an oven to form a semi-cured bonding sheet. The bonding sheet is covered with copper foil and heated and pressed in a laminator. , in order to buffer the transmission of temperature and pressure, a layer of buffer material is placed between the ...

Claims

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Application Information

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IPC IPC(8): B30B15/08B32B37/00H05K3/00
Inventor 吴小连黄伟壮潘华林王水娟方东炜
Owner GUANGDONG SHENGYI SCI TECH
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