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A package and manufacturing method for a microelectronic component

A technology of microelectronics and components, applied in the field of packaging of microelectronic components, can solve the problems of bonding pad pollution, easy damage of microelectronic devices, etc.

Active Publication Date: 2008-07-30
NXP BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Also, this surface contains sensitive microelectronics that can be easily damaged when the dam is mounted on the microelectronic components
Another disadvantage is that mounting the dam on the surface of the microelectronic component, for example through an adhesive layer, can lead to contamination of bond pads located nearby.

Method used

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  • A package and manufacturing method for a microelectronic component
  • A package and manufacturing method for a microelectronic component
  • A package and manufacturing method for a microelectronic component

Examples

Experimental program
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Embodiment Construction

[0033] In Fig. 3, a cross-sectional view of package 70 is shown, taken along line 3-3 in Fig. 4b. The package 70 includes a dam 44 provided on the outer layer 32 on the first side. The dam comprises a stepped surface transition 46 between the outer layer 32 and the wire 14 or a layer 49 below the outer layer (see FIGS. 4a and 4b ). During the curing of the glob material 30 , the dam affects the shape of the glob material 30 to expand the width L of the central region 40 and thus the surface area of ​​the central region. Each inner edge 48 of the outer layer 32 (see FIG. 1 ) is processed, the sealing material is faced in place and an additional layer is applied on top of the layer 32 parallel to said edge of the layer 32, thereby forming a dam 44, as shown in Figure 3. Another solution is to arrange the edge 48 of the outer layer 32 closer to the outside of the carrier element 12, and an additional layer is applied on top of the conductive tracks and the first bottom layer, t...

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PUM

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Abstract

The invention relates to a package (50, 70) for a microelectronic component comprising: a carrier element (12) having a first side (16) containing conductor lines (14); a microelectronic component (20) having a first surface (24) and a second surface (23) facing opposite to the first surface; via said second surface microelectronic components are mounted on said first side and connected via bonding wires (28) to the wires; a polymeric encapsulant (30) encapsulating the bond wires and exposing a central region (40) of the first surface (24), the encapsulant including an outer edge on the first side (36) and an inner edge (38) on said first surface; a dam (42, 44) adjacent to the sealing material; wherein said dam (44) includes a dam (44) on said first side (16) A stepped surface transition (46) on the top, a surface transition adjoining said outer edge (36). The dam (44) affects the formation of the outer (36) and inner (38) edges and enlarges the area of ​​the central region (40) during the manufacture of the sealing material. The invention also relates to a method of manufacturing such a microelectronic component package.

Description

technical field [0001] The invention relates to a package of microelectronic components, comprising: a carrier element with leads; a microelectronic component mounted on the carrier element and connected to the leads via bonding wires; and an encapsulation material for The bonding wires are sealed and the central region of the upper surface of the microelectronic component is exposed. Background technique [0002] Such packaging of microelectronic components is well known. Two common designs of such packages known in the art are described below to give an introduction to the present invention. These designs are shown in Figures 1 and 2, where like numbers indicate like or similar parts. FIG. 1 shows a schematic cross-sectional view of a package of a microelectronic component. Package 10 includes a carrier element 12 having a first side 16 including leads 14 . Microelectronic component 20 is mounted on die pad 18 of the substrate by adhesive 22, which is typically an elec...

Claims

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Application Information

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IPC IPC(8): H01L31/0203H01L21/56H01L23/31H01L33/00H01L27/146B81B7/00B81C5/00H05K3/00H05K3/28G06K9/00B81C99/00H01L33/52H01L33/54
CPCB81C1/00333G01N27/128G01P1/023H01L24/73H01L27/14618H01L31/0203H01L33/52H01L33/54H01L2224/32225H01L2224/45144H01L2224/48091H01L2224/48227H01L2224/73265H01L2924/01079H01L2924/14H01L2924/1461H01L2924/1815H01L2924/18165H01L2924/00014H01L2924/00H01L2924/00012
Inventor 丹迪·N·扎杜卡纳乔纳森·S·卡塔拉诺伊·拉克松乔斯·O·阿米斯托索
Owner NXP BV
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