Device for controlling double-acting air cylinder piston traveling speed

Abstract

The invention provides a device to control the translational speed of the plunger of a double-acting cylinder during wafer process. The device is connected with two inlet ends of the double-acting cylinder to control the motion of the double-acting cylinder. The control device comprises two sets of variable speed gears and a two-position five-way electromagnetic valve. The air intake of the two-position five-way electromagnetic valve of the control device is connected with an air supply; one air outlet of the two-position five-way electromagnetic valve is connected with one inlet end of the double-acting cylinder through a set of variable speed gear; the other air outlet of the two-position five-way electromagnetic valve is connected with the other inlet end of the double-acting cylinder through the other set of variable speed gear. The variable speed gear comprises two throttles and two two-position two-way electromagnetic valves. By adopting the control device, a wafer can move firstly quickly and then slowly in the processes of getting into the seat and out of the seat, thus preventing the wafer from being damaged because of impact.

Description

technical field [0001] The invention relates to semiconductor processing equipment in the field of microelectronics, in particular to a device for controlling the moving speed of a double-acting cylinder piston. Background technique [0002] In semiconductor processing, processing of wafers is usually performed in a reaction chamber. The wafer is sent to the electrostatic chuck in the reaction chamber through a transmission mechanism such as a robot. There are electrodes in the electrostatic chuck and connected to a DC power supply. During processing, the wafer is fixed on the electrostatic chuck by the electrostatic chuck through electrostatic action. After finishing, the wafer is discharged first, then the wafer is lifted by the lifting device, the manipulator enters the reaction chamber to take the wafer away, and then prepares to process the next wafer. [0003] figure 1 It is a structural schematic diagram of an existing wafer lifting device. The wafer seat 2 support...

AI Technical Summary

Problems solved by technology

[0007] During the process of the wafer 1 entering the wafer seat 2, the air pressure pushes the cylinder piston 8 to push the columnar lifting structure 3 to move downward, so the columnar lifting structure 3 moves with a constant and unadjustable force and speed, because the columnar lifting structure 3 The wafer 1 is stationary at the moment of downward movement, so when the columnar lifting structure 3 descends, the wafer 1 is still in the original initial position, and then the wafer 1 is lowered again, and the wafer 1 will hit the columnar lifting structure 3, thereby making a good impact on the wafer 1. irreparable damage to the circuit or even crack the chip 1

In order to avoid this damage, the method of slowing down the moving speed of cylinder piston 8 is often adopted, but thus the cycle time of wafer 1 processing will be increased, thereby reducing production efficiency

Images