Wafer transfer method and grinding device

Abstract

The invention provides a wafer transfer method and a grinding device. Even in a state where the surface tension is strong and the amount of water supplied to hold the wafer on the holding table via the water layer is reduced, the wafer can be peeled from the water layer to be transported. The sucker (171) of the transfer unit (17) is held on the suction position of the wafer (W) on the holding table (163) through the water layer (162), and is set as the sucker center (φ2) so as to be aligned with the wafer (W). ) of the center (φ1) of the wafer does not coincide with the state of being sucked by the chuck (171), and the transfer arm (172) is raised in the vertical direction to transfer, thereby, it is different from the position sucked at the center of the wafer. Compared with the situation, the adsorption and detachment of the wafer (W) from the water layer (162) becomes extremely easy.

Description

Technical field [0001] The present invention relates to a wafer transport method and a grinding device. Background technique [0002] In order to form a semiconductor on the surface, a grinding device is used to grind the surface of a silicon wafer in advance, or a plurality of ICs (Integrated Circuits) and LSIs (Large Scale Integrations) are formed on the surface. The back surface of the semiconductor wafer of the semiconductor chip such as) is ground to form the silicon wafer or the semiconductor wafer to a predetermined thickness. In the grinding device, when the wafer is automatically transferred from the wafer cassette to the chuck table, the positioning of the wafer is necessary, and the technology of positioning the wafer at a predetermined position using the surface tension of water is known (for example, refer to the patent Literature 1, 2). That is, the upper surface of the holding table for positioning is continuously supplied little by little to form a water layer on ...

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Problems solved by technology

[0006] However, although the flow rate of water supplied to the upper surface of the holding table can be small in order to form a water layer for centering of the wafer, when the flow rate of water supplied is small, the surface tension on the wafer is strengthened, even if it is adsorbed by the transfer arm. The suction cup of the wafer rises, and the peeling of the wafer becomes difficult

Therefore, in reality, in order to overcome the surface tension of the water layer and facilitate the adsorption and detachment of the wafer by the suction cup, supplying unnecessary flow rate (for example, 2 liters / minute) of water for centering weakens the Centering under the state of surface tension, resulting in waste of water

Especially in the grinding equipment, since the part of the holding table for positioning is not directly involved in the wafer processing, the consumption of excess water in this part is very uneconomical.

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