Multi-order non-volatility memory and manufacturing method and operation method therefor
A non-volatile, method-of-operation technology, which is applied in static memory, read-only memory, semiconductor/solid-state device manufacturing, etc., can solve the problems of taking a long time and the distribution range of the initial voltage is small, so as to improve the erasing operation speed , save manufacturing cost, increase the effect of process margin
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[0099] FIG. 1 is a cross-sectional view showing the structure of a non-volatile memory according to an embodiment of the present invention.
[0100] Referring to FIG. 1 , the multi-level non-volatile memory proposed by the present invention is, for example, composed of a plurality of memory cells Q1 , Q2 , Q3 , and Q4 disposed on a substrate 100 . Each memory cell Q1, Q2, Q3, Q4 includes a tunneling dielectric layer 102, a charge storage layer 104, an intergate dielectric layer 106, a control gate 108, a top cover layer 110, spacers 112a, 112b, and a doped region 114 , select gate 116 , auxiliary gate 118 and dielectric layers 120 , 122 . The inter-gate dielectric layer 106 , the control gate 108 , and the top cap layer 110 form a stack layer 111 .
[0101] The control gate 108 is, for example, disposed on the substrate 100 . The material of the control gate 108 is, for example, doped polysilicon.
[0102] The charge storage layer 104 is, for example, disposed between the c...
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