Multilayer printed wiring board
A multi-layer printing and circuit board technology, applied in the direction of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problems of peeling, poor ductility, easy cracking of electroless plating film, etc., to improve the integration rate and connection reliability. reduced effect
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[0029] First, the structure of a multilayer printed wiring board 10 according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 8 . FIG. 7 shows a cross-sectional view of the multilayer printed wiring board 10, and FIG. 8 shows a process of mounting an IC chip 90 on the multilayer printed wiring board 10 shown in FIG. state. As shown in FIG. 7 , in the multilayer printed wiring board 10 , conductor loops 34 are formed on the surface of the core substrate 30 . The front and back surfaces of the core substrate 30 are connected by through holes 36 . The through hole 36 is composed of capping plating layers 36a, 36d constituting the through hole land, and a side wall conductor layer 36b, and the inside of the side wall conductor layer 36b is filled with a resin filling material 37. It is also possible to fill only copper without using a resin filler. The interlaminar resin insulating layer 50 and the interlaminar resin insulating laye...
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