Commutating diode device and its production

Abstract

The invention is concerned with rectifier diode equipment and production. The plastic package to the diode equipment contains some connecting ends and framework. The latter has some different electrical specification diode crystal, it and some connecting ends have output / input end with different thickness according to the electrical specification to diode crystal, and the output / input end is out of the plastic package. Each diode crystal has corresponding connecting part with each connecting end, and during the working time, will connect with circuit board according to its electrical specification. When different current or voltage passes through the diode, each diode crystal is natural and the connecting part will work according to the electrical specification of each diode crystal. It will enhance the working efficiency of power supply, the space of circuit and reduce the cost of power supply without burning.

Description

technical field [0001] The invention relates to a rectifier diode device and a manufacturing method, especially a diode device with a plurality of diode crystals with different electrical characteristics inside, which can simultaneously supply different voltages and currents (non-balanced currents). Background technique [0002] With the rapid growth of electronic technology and the development trend of light, thin, short and small electronic products, many electronic products have been miniaturized one after another, and in the circuit board, almost many components have gone to the integrated circuit manufacturing method. However, components in the form of integrated circuits must consider more aspects when using them, such as withstand voltage, anti-noise, and mutual interference of internal components. [0003] Especially for the components used on the power supply side of the circuit board, such as the components used in the power supply, the tolerance of the voltage and...

AI Technical Summary

Problems solved by technology

[0006] (1) There are several diodes packaged in the diode integrated circuit. In order to avoid the voltage difference between the diodes, diodes with similar electrical characteristics must be packaged in the diode integrated circuit. However, in the circuit board, the voltage and current of each area are different. All the same, so the diode integrated circuit cannot match the voltage and current in the circuit board to set the diode, so it loses the meaning of the diode integrated circuit design

[0007] (2) In general integrated circuit packaging, the internal chip and the external pins will be electrically connected by aluminum wire or welding. There is only a single conduction line between the external pins, so when the diode integrated circuit is in use, if the voltage or current is too large, the conduction line will be melted, and the diode integrated circuit will be damaged.

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