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Dry production process for producing epoxy moulding plastic super fine silicone micropowder

An epoxy molding compound and production process technology, applied in fibrous fillers, chemical instruments and methods, other chemical processes, etc., can solve the problems of difficult dispersion, easy agglomeration, high surface energy, and achieve the effect of avoiding energy consumption

Inactive Publication Date: 2007-08-29
阮建军
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, due to the technical characteristics of ultrafine silica powder itself, such as large specific surface area, high surface energy, easy agglomeration, and difficult dispersion, it is necessary to achieve continuous dry production of ultrafine silica Micropowder needs to overcome many technical, process, and equipment problems. At present, there is no large-scale production line for continuous dry production of 0.13-0.1μm TQFP packaging epoxy molding compound ultrafine silicon micropowder in China.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0011] Example 1. A dry-method production process of epoxy molding compound ultrafine silicon powder for packaging. The steps are as follows: select high-purity quartz sand as the raw material, adjust the ratio of the raw materials as required; perform magnetic separation and iron removal on the prepared mixture ; Then select the appropriate grinding media ratio for grinding according to the needs; carry out precision classification of the materials that have been ground to a certain fineness; carry out dry surface modification on the classified products; carry out the classification of the surface modified products again, namely Obtain the finished superfine silicon powder.

Embodiment 2

[0012] Example 2. In Example 1, the produced ultrafine silicon powder D50=1μm; D90≤10μm; moisture≤0.1%; hydrophobicity≥45min; SiO2≥99.8%; Fe 3+ ≤10ppm; Na + ≤10ppm; Cl + ≤10ppm; Ec≤5μS / cm; PH value is 5.5.

Embodiment 3

[0013] Example 3. In Example 1, the produced ultrafine silicon powder D50=8μm; D90≤10μm; moisture≤0.1%; hydrophobicity≥45min; SiO2≥99.8%; Fe 3+ ≤10ppm; Na + ≤10ppm; Cl + ≤10ppm; Ec≤5μS / cm; PH value is 7.5.

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PUM

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Abstract

The invention relates to a packaging using epoxy mould plastic superfine silicon micro powder dry method producing technology. It includes the following steps: adopting high purity quartz sand as raw material, mixing the material; taking magnetic separation removing iron, taking grinding by suitable grinding medium; taking refined classification to the material; taking dried surface modification to the product after classified; taking reclassification to gain the superfine silicon micro powder. The invention could replace the imported 0.13-0.1um TQFP packaged epoxy mould plastic superfine silicon micro powder.

Description

Technical field [0001] The invention relates to a production process of silicon micropowder, in particular to a dry production process of epoxy molding compound ultrafine silicon micropowder for packaging. Background technique [0002] Microelectronics technology with integrated circuits as the core is the leading field of high-tech development in the contemporary world. Countries all over the world are competing to develop the microelectronics industry. my country attaches great importance to the development of the microelectronics industry and lists it as a key pillar industry of the national economy. Support. In recent years, my country's integrated circuits (IC) have developed rapidly, with an annual growth rate of more than 30%. With the development of the domestic IC industry, the process feature size has been shrinking from 5 microns, 3 microns, 1 microns... to 0.25 microns, 0.18 microns, and 0.1 microns. The corresponding integrated circuits have also changed from small s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09C1/28C09C3/04C09K3/10
Inventor 阮建军
Owner 阮建军
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