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Composite process for producing 210-400 mum superthick electrolytic copper foil, and apparatus thereof

A technology of electrolytic copper foil and composite process, applied in electrolytic process, electroforming and other directions, can solve the problems of difficult to control roughness of ultra-thick copper foil and inability to form

Active Publication Date: 2010-01-06
惠州联合铜箔电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the thickness of the copper foil is ≥ 210 μm, it is impossible to control the roughness of the matte surface of the copper foil by adding additives. When rolling, the extrusion of rough surface copper particles and the peeling roller will cause large area pinholes in the copper foil and cannot be formed

Method used

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  • Composite process for producing 210-400 mum superthick electrolytic copper foil, and apparatus thereof
  • Composite process for producing 210-400 mum superthick electrolytic copper foil, and apparatus thereof
  • Composite process for producing 210-400 mum superthick electrolytic copper foil, and apparatus thereof

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Effect test

Embodiment example 1

[0018] The process parameters for producing 210μm ultra-thick electrolytic copper foil are:

[0019] 1) Current A is 30KA;

[0020] 2) The rotation speed of cathode roller is 0.17m / min;

[0021] 3) The flow rate of copper sulfate solution is 50m 3 / h;

[0022] 4) The temperature of the copper sulfate solution is 55°C±2;

[0023] 5) Adopt traditional production <210μm electrolytic copper foil addition process;

[0024] 6) The speed of the polishing roller is 350 rpm;

[0025] 7) The grinding wheel grain size of the polishing roller is 600 # ;

[0026] 8) The swing frequency of the polishing roller is 200 times / min;

[0027] 9) The swing of the polishing roller is 1cm.

[0028] The roughness Ra of the rough surface of the copper foil was detected to be 9.8 μm.

Embodiment example 2

[0030] The process parameters for producing 400μm ultra-thick electrolytic copper foil are:

[0031] 1) Current A is 25KA;

[0032] 2) The rotation speed of cathode roller is 0.09m / min;

[0033] 3) The flow rate of copper sulfate solution is 70m 3 / h;

[0034] 4) The temperature of the copper sulfate solution is 55°C±2;

[0035] 5) Adopt traditional production <210μm electrolytic copper foil addition process;

[0036] 6) The speed of the polishing roller is 600 rpm;

[0037] 7) The grinding wheel grain size of the polishing roller is 600 # ;

[0038] 8) The swing frequency of the polishing roller is 200 times / min;

[0039] 9) The swing of the polishing roller is 1cm.

[0040] The roughness Ra of the rough surface of the copper foil was detected to be 12.8 μm.

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Abstract

An extra-high build electrolytic copper foil with roughness Ra<= 20 mum and thickness 210-400 mum and its preparation technology and equipment. The equipment consists of cathode roll, overflow launder, anode launder, wipe roll, cleaning shop, braced frame and so on. It has the following characters: flexible materials were adopted between wipe roll and copper foil; on-line rubbing down equipment with press roll and polishing roll were fixed behind the wipe roll. The preparation technology includes copper foil peel off, polish, cleanout, antioxidate treatment, dry, wind-up and the final product.

Description

technical field [0001] The invention belongs to the field of electrolytic copper foil manufacturing, and in particular relates to a composite process method and equipment for producing 210-400 μm ultra-thick electrolytic copper foil. Background technique [0002] With the expansion of the use of electrolytic copper foil year by year, breakthroughs have been made in the use of ultra-thick copper foil in the automotive industry to solve the problems of traditional main circuit loops due to large current, temperature rise, and space occupation. According to the industry According to forecasts, the demand for printed circuit boards made of ultra-thick electrolytic copper foil in the automotive industry will increase significantly from 2005, but how to produce ultra-thick electrolytic copper foil that meets the standards based on this market information The key issues facing the community. In the traditional production equipment and process, the production of copper foil is as f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D1/04
Inventor 杨初坤
Owner 惠州联合铜箔电子材料有限公司
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