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SMT no-lead tinol

A lead-free solder paste and solder paste technology, used in welding media, welding equipment, welding/cutting media/materials, etc., can solve problems such as incomprehension of welding performance, and achieve low corrosiveness, light color, and high insulation resistance. Effect

Inactive Publication Date: 2009-12-23
SHENZHEN UNIBRIGHT TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to solve the technical problems of solder paste in the prior art that the color of the residue in soldering is relatively dark, and the soldering performance is not understood, and provide a SMT soldering paste with good soldering performance and light color of the residue after soldering

Method used

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Examples

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Embodiment Construction

[0013] The invention provides a solder paste for surface mount technology lead-free solder paste, wherein the solder paste includes a solvent, a thixotropic agent, an adhesive, a composite active agent, a surfactant and an antioxidant, and the composite active agent is composed of The composite active agent that methyl succinic acid and other organic acids, halogen salts forms, and described halogen salts is diphenylguanidine hydrobromide or diphenylguanidine hydrochloride, the following is the formula of solder paste of the present invention Examples and comparative examples. See Table 1:

[0014]

[0015]

[0016] Table 1

[0017] After making the products of the above comparative examples and examples, referring to the detection method of SJ / T11186-1998 "General Specification for Tin-Lead Paste Solder", it was tested for wettability, solder ball and observed the storage stability of solder paste , The color and storage stability of the secondary reflow soldering res...

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Abstract

The invention relates to a solder paste for SMT lead-free solder paste, comprising a solvent, a thixotropic agent, a composite adhesive, an active agent, a surfactant and an antioxidant, and the composite active agent is composed of methyl succinic acid and Composite active agents formed from other organic acids and halogen salts, the halogen salts are diphenylguanidine hydrobromide or diphenylguanidine hydrochloride, and the antioxidant is 2.6-di-tert-butyl-4- methyl phenol. The use of the solder paste for SMT lead-free solder paste of the present invention meets the requirements of the market and environmental protection. At the same time, the present invention uses methylsuccinic acid to form a composite active agent with other organic acids and halogen salts, and the wettability of the lead-free solder paste manufactured Good, good printability, uniform and delicate paste, light color of residue after soldering, low corrosion, good storage stability, and can meet the requirements of secondary reflow soldering of double-sided circuit boards in the electronics industry.

Description

technical field [0001] The invention relates to a solder paste for surface mounting (SMT) lead-free solder paste. Background technique [0002] The lead-free solder paste used in the assembly process of traditional electronic products is mainly composed of tin alloy powder and solder paste. The tin powder alloy is mainly an alloy composed of 63% tin and 37% lead, and its melting point is 183°C , but the European Union announced the ROHS Directive, stipulating that from July 1, 2006, electronic and electrical products containing six hazardous substances of lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls and polybrominated diphenyl ethers exceeding the specified limit levels are prohibited Entering the EU market, and China's ROHS will be officially implemented on March 1, 2007, so electronic companies must use new materials and new technologies to meet the market's green environmental protection and lead-free requirements. With the research of lead-free ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/22B23K35/26
Inventor 王琏郭艳萍
Owner SHENZHEN UNIBRIGHT TECH
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