Amplification type solid state imaging device
A solid-state imaging device, a large-scale technology, applied in the direction of electric solid-state devices, semiconductor devices, electrical components, etc., can solve the problems of image quality degradation, noise removal performance, etc., and achieve the effect of suppressing the degradation of image quality
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no. 1 approach
[0046] Below, refer to figure 1 2, the amplifying solid-state imaging device according to the first embodiment of the present invention will be described. figure 1 It is a schematic diagram showing the layout of the amplifying solid-state imaging device according to the first embodiment of the present invention. Figure 2 is a representation of figure 1 A cross-sectional view of a part of the enlarged solid-state imaging device shown, and shows along the figure 1 The state where the section line A-A' in the section is cut. Note that, in FIG. 2 , hatching is omitted for the main portion of the semiconductor substrate 7 and the insulating layer 22 .
[0047] Such as figure 1 As shown, the amplifying solid-state imaging device includes: a light receiving unit 10 , a reading unit, and a noise removal circuit 11 , all of which are provided on a semiconductor substrate 7 . The light receiving unit 10 is formed by arranging a plurality of pixels one-dimensionally or two-dime...
no. 2 approach
[0072] Next, refer to image 3 4, an amplifying solid-state imaging device in a second embodiment of the present invention will be described. image 3 It is a schematic diagram showing the layout of the amplifying solid-state imaging device according to the second embodiment of the present invention. Figure 4 is a representation of image 3 A cross-sectional view of a part of the enlarged solid-state imaging device shown, and shows along the image 3 The cutting line B-B' in the state.
[0073] again, in image 3 and Figure 4, given the figure 1 or the marked part shown in Figure 2 is with the figure 1 Or the same part as the part given the same mark in FIG. 2 . In addition, in FIG. 4 , hatching is omitted for the main part of the semiconductor substrate 7 and the insulating layer 22 . Also, the parts given the same hatching in FIG. 4 are parts having the same function.
[0074] Such as image 3 As shown in FIG. 4 , the second embodiment is also the same as the firs...
no. 3 approach
[0081] Next, refer to Figure 5 , the amplifying solid-state imaging device in the third embodiment of the present invention will be described. Figure 5 It is a schematic diagram showing the layout of the amplifying solid-state imaging device according to the third embodiment of the present invention. again, in Figure 5 in, endowed with figure 1 The marked parts shown are the same as in the figure 1 The same part as the part assigned the same mark.
[0082] Such as Figure 5 As shown, in this third embodiment, with image 3 Unlike the illustrated example, the second light-shielding layer 2 and the third light-shielding layer 3 are electrically connected by wiring 33 other than the second wiring 32 . Again, for structures other than this, Figure 5 The amplified solid-state imaging device shown has the same image 3 The amplified solid-state imaging device shown has the same structure.
[0083] Specifically, at one side (right side in the figure) end of the second ...
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