Shielding method for infrared remote control receiving amplifier and infrared remote control receiving amplifying device thereof

Abstract

The invention discloses an infrared remote receiving amplifier and method for shielding the amplifier. The apparatus comprises: photosensitive receiving chip, semi-conductor amplifying integrated circuit chip, and mount, metal wire screened and encapsulation body, wherein the metal wire screened is screened on two chips and being stuck with mount, the metal wire screened has a first grid area of low density. By employing the structure, the metal wire screened receives infrared signal with the first grid area and realizes screen with grids. The invention has the advantages of having good screening effect and extending receiving distance of receiving device.

Description

technical field [0001] The invention relates to a combination of an integrated circuit and a photoelectric component in the electronics industry, in particular to a shielding method for an infrared remote control receiving amplifier and an infrared remote control receiving amplifier. Background technique [0002] Infrared remote control technology is a technology that uses infrared rays for point-to-point communication. Infrared rays are outside visible light in the spectrum, so they have strong anti-interference and have the characteristics of straight-line propagation of light waves, which are not easy to cause mutual interference. It is a good information transmission medium . The use of infrared remote control technology has the characteristics of no signal interference, high transmission accuracy, small size, low power, and low cost. Therefore, it is widely used in various electronic fields, especially in the field of home appliances such as color TVs, DVDs, air conditi...

AI Technical Summary

Problems solved by technology

However, on the one hand, due to the poor anti-interference ability of semiconductor amplifier integrated circuits; Electromagnetic interference; if the two chips of the photosensitive receiver and the preamplifier are directly packaged, the semiconductor amplifying integrated circuit will be easily affected by electromagnetic interference and affect the stability and reliability of the work. Therefore, the semiconductor amplifying integrated circuit chip is Shielding is key to integrating photosensitive receivers with preamplifiers

In order to solve this problem, referring to Fig. 1, the prior patent in Germany adopts the integral extension of the support plate body 21' to form a sheet body 33', and then turns the sheet body 33' over to form a block cover Covered on the photosensitive receiver chip 11' and the semiconductor amplifying integrated circuit chip 12', thereby forming a shield to the semiconductor amplifying integrated circuit, wherein the middle part of the sheet body 33' is hollowed out 301' to make the photosensitive receiver easy to receive, because the blocking plate 33 ' and the plate body 21' that fixes the two chips 11', 12' are all empty, which makes the shielding effect poor, and because the flipping of the plate body 33' requires mechanical stress, it is easy to cause damage to the gold wire of the integrated circuit; See Fig. 2, and Japan's prior patent is to make a cover 3' with an iron shell, and also hollow out 301' at the photosensitive receiver, and then use mechanical equipment to rivete the cover 3' to fix the photosensitive receiver chip 11' and the board body 21' of the semiconductor amplifying integrated circuit chip 12', although the shielding effect has been improved compared to the German patent, it is still insufficient, and the installation is extremely troublesome, requiring special equipment, resulting in large mechanical stress, The potential damage is also large. At the same time, due to the high cost, its cost performance is poor, and the volume is also large, which is not conducive to the miniaturization of electronic components.

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