Electromagnetic noise suppressor, article with electromagnetic noise suppression function, and their manufacturing methods

A technology of noise suppression and electromagnetic wave, applied in the direction of magnetic objects, circuits, magnetic materials, etc., can solve the problems of light weight, large thickness of electromagnetic wave interference suppression body, and inability to meet high-density assembly.

Inactive Publication Date: 2008-05-14
SHIN-ETSU POLYMER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0021] However, in this EMI suppressor, since the EMI suppressor itself is thick and contains a large number of magnets over the entire range of the insulating magnetic layer, it is too heavy to achieve weight reduction.
In addition, since the amount of the organic binder is small, the firmness and flexibility are not sufficient, and it is not satisfactory for realizing high-density assembly.

Method used

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  • Electromagnetic noise suppressor, article with electromagnetic noise suppression function, and their manufacturing methods
  • Electromagnetic noise suppressor, article with electromagnetic noise suppression function, and their manufacturing methods
  • Electromagnetic noise suppressor, article with electromagnetic noise suppression function, and their manufacturing methods

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0285] The base is 12μm thick polyethylene terephthalate film (hereinafter referred to as PET) (shear modulus of 3.8×10 9 (Pa), the carbon dioxide transmittance is 1×10 -11 [cm 3 (STP)cm / (cm 2 ×s×cmHg)], the average surface roughness is 1.8μm), the Mn-Zn high-permeability ferrite with a converted film thickness of 3nm is sputtered by opposing target magnetron sputtering to form a composite Floor. The surface resistance of the composite layer was measured with great care by the DC 4-terminal method. In addition, the film was adjusted to the desired size, a polyester adhesive was inserted in the middle of ten films and laminated, and they were integrated by vacuum press molding to obtain an electromagnetic noise suppressor with a total thickness of 138μm. . Next, the specific gravity and electromagnetic wave noise suppression characteristics were measured. The results are shown in Table 1.

Embodiment 2

[0287] On a PET film with a thickness of 25 μm as a support layer, a silicon (oxygen) rubber with a thickness of 20 μm as a substrate (shear modulus of 1×10 7 (Pa), carbon dioxide transmittance is 2.2×10 -7 [cm 3 (STP)cm / (cm 2 ×s×cmHg)]), on which a Fe-Ni-based soft magnetic metal with a film thickness of 20 nm converted to a film thickness of 20 nm was sputtered to form a composite layer by the magnetron sputtering method on the opposite target. The surface resistance of the composite layer was measured with great care by the DC 4-terminal method. In addition, the film was adjusted to a desired size to obtain an electromagnetic wave noise suppressor having a total thickness of 45 μm. Next, the specific gravity and electromagnetic wave noise suppression characteristics were measured. The results are shown in Table 1.

Embodiment 3

[0289] On a PET film with a thickness of 25 μm as a support layer, a polyurethane gel with a thickness of 10 μm as a substrate (shear modulus of 1.7×10 6 (Pa), carbon dioxide gas transmittance is 5.3×10 -8 [cm 3 (STP)cm / (cm 2 ×s×cmHg)]), on which a composite layer was formed by sputtering a Fe-Si-Al-based soft magnetic metal with a film thickness of 15 nm converted by a magnetron sputtering method (non-opposing target type). The surface resistance of the composite layer was measured with great care by the DC 4-terminal method. Furthermore, a 2 μm polyurethane gel was coated on the composite layer and sputtered again. By repeating this process, three composite layers were set to obtain an electromagnetic wave noise suppressor with a total thickness of 79 μm. Next, the specific gravity and electromagnetic wave noise suppression characteristics were measured. The results are shown in Table 1.

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Abstract

An electromagnetic noise suppressor is disclosed in the present invention, which includes a base material(2) containing a binding agent and a composite layer(3) formed by integrating the binding agent that is a part of the base material 2 and the magnetic material. This electromagnetic noise suppressor has high electromagnetic noise suppressing effect in the sub-microwave band, and enables it to reduce the space requirement and weight. The electromagnetic noise suppressor can be manufactured by forming the composite layer 3 on the surface of the base material 2 by physical vapor deposition of the magnetic material onto the surface of the base material 2. The article with an electromagnetic noise suppressing function of the present invention is an electronic component, a printed wiring board, a semiconductor integrated circuit or other article of which at least a part of the surface is covered by the electromagnetic noise suppressor of the present invention.

Description

Technical field [0001] The invention relates to an electromagnetic wave noise suppression body, an article with electromagnetic wave noise suppression function and a manufacturing method thereof. Background technique [0002] In recent years, with the popularization of the Internet, personal computers, information appliances, wireless LAN, Bluetooth, optical modules, mobile phones, portable information terminals, advanced road information systems, etc., have high clock frequencies in the quasi-microwave band (0.3-10 GHz) CPUs, electronic devices using high-frequency buses, and information communication equipment using radio waves are also becoming popular, ushering in a ubipuitous network society where high-speed digitalization and low-voltage drive devices require higher performance. However, with the popularization of these devices, the electromagnetic waves radiated by these devices have caused problems such as misoperation of themselves or other electronic devices, and effect...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K9/00H01F1/00
Inventor 川口利行藤木弘直谷口敦权田贵司田原和时
Owner SHIN-ETSU POLYMER CO LTD
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