Semiconductor device, method of manufacturing semiconductor device, and solid-state image sensor
a semiconductor and semiconductor technology, applied in semiconductor devices, electrical equipment, radio frequency controlled devices, etc., can solve the problems of increasing manufacturing costs, damage other parts, and deteriorating semiconductor integration density, so as to reduce the restriction on design necessary for avoiding charging damage, suppress transistor characteristics due to charging damage, and reduce design freedom
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first embodiment
(A) First Embodiment
[0047]FIG. 1 is a view illustrating a cross section of a main part of a semiconductor device 100 according to the present embodiment.
[0048]The semiconductor device 100 is a semiconductor chip formed using silicon or the like and includes a vertical electrode 30 extending along a thickness direction of the semiconductor device 100. Hereinafter, a portion in the semiconductor chip, the portion serving as a base before the vertical electrode 30 is formed, is called base 10.
[0049]The vertical electrode 30 electrically connects wiring 11 extending along one surface 10A of the base 10 and a portion to be connected T such as an electrode pad inside the base 10. The vertical electrode 30 is a concept including various aspects and includes a bottomed via and a contact formed in a bottomed hole extending along a thickness direction of the base 10.
[0050]Note that, hereinafter, a case in which specific wiring in a wiring layer 10b stacked and formed on a surface of a semicon...
second embodiment
(B) Second Embodiment
[0079]FIG. 8 is a view illustrating a cross section of a main part of a semiconductor device 200 according to the present embodiment. The semiconductor device 200 has a similar configuration to the above-described semiconductor device 100 except shapes of a low-resistance film and an insulating film in a vicinity of a hole bottom and a barrier metal film and a conductive portion formed on the low-resistance film and the insulating film.
[0080]Therefore, hereinafter, shapes and a method of manufacturing the low-resistance film and the insulating film in the vicinity of the hole bottom and the barrier metal film and the conductive portion formed on the low-resistance film and the insulating film of the semiconductor device 200 will be mainly described and detailed description of other configurations is omitted, and signs are given by adding 2 to the beginning of the signs of the configuration of the semiconductor device 100 as necessary.
[0081]A low-resistance film ...
third embodiment
(C) Third embodiment
[0091]FIG. 12 is a view illustrating a cross section of a main part of a semiconductor device 300 according to the present embodiment. The semiconductor device 300 has a similar configuration to the above-described semiconductor device 100 except the number of times of stacking of a low-resistance film.
[0092]Therefore, hereinafter, a shape and a manufacturing method regarding stacking of the low-resistance film of the semiconductor device 300 will be mainly described and detailed description of other configurations is omitted, and signs are given by adding 3 to the beginning of the signs of the configuration of the semiconductor device 100 as necessary.
[0093]A low-resistance film 314 of the semiconductor device 300 is similar to the low-resistance film 14 of the semiconductor device 100 in being continuously provided from a vicinity of an opening portion 312a to a vicinity of a hole bottom 312b of a vertical hole 312 inside an insulating film 313.
[0094]The low-re...
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Abstract
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