Heat-dissipating device

Inactive Publication Date: 2011-05-19
SUNONWEALTH ELECTRIC MACHINE IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0008]The primary objective of the present invention is to provide a heat-dissipating device having a balanced heat-dissipating effect.
[0010]The present invention fulfills the above objectives by providing, in a preferred form, a heat-dissipating device comprising a heat-dissipating member, at least one heat-dissipating fan, and a rotation control unit. The heat-dissipating member has an airflow chamber inside and includes a plurality of air-guiding holes in communication with the airflow chamber. Each of the at least one heat-dissipating fan has two air-guiding portions, wherein one of the air-guiding portions is aligned with one of the air-guiding holes of the heat-dissipating member. The rotation control unit communicates with and controls the at least one heat-dissipating fan. Accordingly, the heat-dissipating device with a dust auto-removing function can provide a balanced heat-dissipating effect.

Problems solved by technology

Furthermore, dust is liable to accumulate at specific area such as the compartment 911, the first heat-dissipating fan 92 and the second heat-dissipating fan 93, and thus adversely affects the heat-dissipating effect.
Further, the heat-dissipating device 9 could not effectively lower the temperature of the electronic elements close to the second heat-dissipating fan 93.
Overall, the heat-dissipating effect of the heat-dissipating device 9 is unsatisfactory and is not uniform.

Method used

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Examples

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Embodiment Construction

[0024]A heat-dissipating device according to the preferred teachings of the present invention is shown in FIG. 3. The heat-dissipating device includes a heat-dissipating member 1, at least one heat-dissipating fan 2, and a rotation control unit 3 adopted for control over rotating direction of the said at least one heat-dissipating fan 2.

[0025]The heat-dissipating member 1 can be integrated with an electronic product having at least one electronic element. The heat-dissipating member 1 is a hollow casting and preferably made of heat-conducting material, especially of material with high thermal conductivity. The heat-dissipating member 1 has an airflow chamber 11 inside and includes a plurality of air-guiding holes 12 in communication with the airflow chamber 11.

[0026]The at least one heat-dissipating fan 2 can be of blower type or axial flow type. In the preferred form shown in FIG. 3, the heat-dissipating device includes one heat-dissipating fan 2 of axial type. Furthermore, the hea...

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PUM

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Abstract

A heat-dissipating device comprises a heat-dissipating member, at least one heat-dissipating fan, and a rotation control unit. The heat-dissipating member has an airflow chamber inside and includes a plurality of air-guiding holes in communication with the airflow chamber. Each of the at least one heat-dissipating fan has two air-guiding portions, wherein one of the air-guiding portions is aligned with one of the air-guiding holes of the heat-dissipating member. The rotation control unit communicates with and controls the at least one heat-dissipating fan. Accordingly, the heat-dissipating device with a dust auto-removing function can provide a balanced heat-dissipating effect.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a heat-dissipating device and, more particularly, to a heat-dissipating device capable of integrating with a plurality of heat sources in various electronic products to provide heat-dissipating function.[0003]2. Description of the Related Art[0004]During the operation of electronic products such as lamps, backlighted modules, liquid crystal display (LCD), and computers etc., heat is generated easily. Therefore, heat-dissipating devices are widely utilized to maintain normal operation and lifetime of electronic products.[0005]Furthermore, plural electronic elements of electronic products such as motherboards, microprocessors or chips of computers must be put together in a heat-dissipating member of heat-dissipating devices with plural heat-dissipating fans for heat-dissipating purpose.[0006]FIGS. 1 and 2 shows a conventional heat-dissipating device including a heat-dissipating member 91 a...

Claims

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Application Information

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IPC IPC(8): F28D21/00
CPCH01L23/467H05K7/2019H05K7/20209H01L2924/0002H01L2924/00
Inventor HORNG, ALEXMIYAHARA, MASAHARU
Owner SUNONWEALTH ELECTRIC MACHINE IND
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