Socket for PGA package

a technology for sockets and packages, applied in the direction of electrical apparatus construction details, contact member manufacturing, coupling device connections, etc., can solve the problems of lack of process yield, difficult to hold the terminal, and difficult to make the terminal

Inactive Publication Date: 2002-03-14
MOLEX INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the typical structure of the terminal as set forth above, it is difficult to hold the terminal by the insulative housing in the structure of FIG. 13, since a moment is caused on the terminal when the pin of the package is engaged with the contact piece.
Furthermore in the structure of FIG. 14, the terminal becomes relatively large upon being spread out, so that it lacks for process yield in case of stamping it from a resilient metal sheet.
In conjunction therewith, it is difficult to make the terminal, since it is necessary to balance the resilience of the mutually opposing contact pieces.

Method used

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  • Socket for PGA package
  • Socket for PGA package
  • Socket for PGA package

Examples

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Embodiment Construction

[0025] The present invention will be discussed hereinafter in detail in terms of preferred embodiments of the present invention with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It will be obvious, however, to those skilled in the art that the present invention may be practiced without these specific details. In other instance, well-known structures are not shown in detail in order to avoid unnecessarily obscure the present invention.

[0026] FIGS. 1 and 2 are, respectively, illustration of one embodiment of a terminal 1. The terminal 1 is provided with anchor portions 4 each comprising an engaging projection 3 along the side edges of a planar main body 2. A contact piece 5 and a solder tail 6 are respectively extended from the lower end of the main body 2. The contact piece is folded back into generally U-shaped configuration to be opposed to the mai...

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Abstract

A socket for a PGA package includes a planar insulative housing for mounting a plurality of terminals in grid array fashion. Each of the terminals has a solder tail projecting from one side surface of the insulative housing to be soldered to a printed circuit board. Each of the terminals includes a planar main portion extending in the direction of mounting to the insulative housing, an anchor portion for engaging with the insulative housing on side edges of the main body, a contact piece folded back into generally U-shaped configuration from a lower end of the main body and mutually opposing to the main body, and a solder tail extending toward the printed circuit board. The contact piece has a contact portion on an outside surface thereof for contacting with a pin of the PGA package.

Description

[0001] 1. Field of the Invention[0002] The present invention relates generally to a socket for a PGA (pin grid array package to which the PGA package can be connected.[0003] 2. Description of the Related Art[0004] Conventionally, a socket for a PGA package as shown in FIG. 12 is well known in the art (See Japanese Unexamined Patent Publication (Kokai) No. Heisei 9-204969 and Japanese Unexamined Patent Publication (Kohyo) No. Heisei 10-508143 and the like, for example). The socket f or the PGA package comprises a planar insulative housing 300 in which terminals are located in grid array fashion, and a cover 302 including pin insertion holes 301 formed in grid array fashion corresponding to the respective terminals. It is possible to slide the cover 302 on the insulative housing 300 by operation of a lever 303 and the like. Upon sliding the cover 302, pins of the PGA package respectively opposing to a contact piece of the respective terminals through the respective pin insertion holes...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H01R13/115H01R33/76H01R43/16H01R43/20H05K7/10
CPCH01R43/16H01R43/20H05K7/1084
Inventor HIRATA, TOSHIHISASASAO, MASAMIHIRAYAMA, TAKAAKI
Owner MOLEX INC
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