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Method for return repairing image sensing mould set and clamp therewith

An image sensing and module technology, used in image communication, color TV parts, TV system parts, etc. Improve efficiency and ensure the effect of yield

Inactive Publication Date: 2007-06-20
深圳市合力泰光电有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the unstable factors of equipment and personnel, uneven temperature of hot pressing, point-to-point deviation and other adverse factors, it is easy to cause interruption of signal transmission, resulting in abnormal operation of the product
In response to such defects, the industry generally adopts the method of tearing the connection, cleaning the residual glue at the welding place with a cleaning solution, and using new raw materials to re-weld. This method cannot effectively reuse the removed raw materials, resulting in production costs. improve

Method used

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  • Method for return repairing image sensing mould set and clamp therewith
  • Method for return repairing image sensing mould set and clamp therewith
  • Method for return repairing image sensing mould set and clamp therewith

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0042] Implementation mode 1: In a tenth-level clean environment, prepare the camera module to be cleaned, use the adjusted image sensing module disassembly fixture, put the product into the disassembly fixture, and use the disassembly fixture to unpack the packaged camera module. The module is divided into two parts, one part is the lens module, the other part is the PCB board and the camera chip fixed on the PCB board, and then the edge part of the PCB board is fixed with a blowing fixture and the camera chip is exposed to the outside, and the vacuum ion is adjusted. Clean the air gun, blow and wash the photosensitive area of ​​the wafer polluted by dust particles under a microscope (125x is suitable), check the cleanliness and appearance of the product after cleaning, and finally replace it with a good product lens module, stick it in the plastic disk After applying AB glue, the glued lens module is packaged on the purge jig, and after being baked in an oven at 75°C for 90 m...

Embodiment approach 2

[0043] Implementation mode 2: In a tenth-level clean environment, prepare a camera module with abnormal imaging, adjust the actual temperature of the reflow heating platform to 200°C, and place the ACF glue hot-press welding part of the product to be repaired on the heating platform covered with thermally conductive silicone skin Put it on (the role of the heat-conducting silicone skin is to make the product evenly heated), place it for 10 seconds, the ACF glue part of the product has been heated and softened, take it off immediately, gently pull the two solders (ie FPC and PCB board), and then use ACF The remover cleans the residual glue on the PCB board or FPC pad, and then re-presses the FPC and PCB board on the pressure welding machine, and then conducts the camera function test to check the camera effect after repair, so as to achieve the secondary quality of the material. The effect of using.

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Abstract

The invention is concerned with the reworking method for image inducting module, including the following steps: 1) removes the clamp to separate the camera lens module group of the camera module group and PCB board fixing with the camera wafer; 2) fixes the PCB on the clamp and emerges the wafer; 3) blows the dust on the wafer inducting area by the blowing equipment; 4) sets the camera lens on the PCB board. The invention can improve the reworking effect efficiently, and reduce the eye tire of the operator.

Description

【Technical field】 [0001] The invention relates to a repairing method and a repairing fixture of an image sensing module. 【Background technique】 [0002] In the field of semiconductor packaging, the packaging of image sensing modules is a special packaging method. In view of the high precision of the photosensitive chip and the high sensitivity to dust particles, there are very high standards for the packaging process. . [0003] During the packaging process of the CMOS camera, it needs to be operated in a high-cleanliness environment (class ten). However, due to unstable factors such as the environment and equipment, it is difficult to avoid the intrusion of tiny pollutants during the operation of personnel. Such products When tested after flowing out, the display will show black spots, dirt or dirty spots at the corresponding positions. In addition, when the semiconductor package needs to use ACF conductive adhesive hot pressing method for signal transmission, it is also ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/50H01L21/687H04N5/225
Inventor 徐斌靳文
Owner 深圳市合力泰光电有限公司
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