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Vacuum air-discharging system

A vacuum exhaust and vacuum pump technology, which is applied to electrical components, circuits, liquid fuel engines, etc., can solve problems such as vacuum pump stop, reaction by-products mixed in, and impact on pump limit pressure, etc., to achieve the effect of prolonging life and improving efficiency

Inactive Publication Date: 2006-12-13
EBARA CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In the existing vacuum exhaust system, a certain amount of shaft seal gas is always introduced regardless of the processing state. However, if a large amount of shaft seal gas is poured in, it will affect the ultimate pressure of the pump at no load, so there is a need to reduce Introduced shaft seal gas volume
However, if the amount of shaft seal gas decreases, there is a problem that by-products of the reaction are mixed into the bearings and lubricating oil of the pump rotor, and the vacuum pump stops.

Method used

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  • Vacuum air-discharging system

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Embodiment Construction

[0026] Refer below Figure 1 to Figure 8 Embodiments of the vacuum exhaust system of the present invention will be described in detail. In addition, in Figure 1 to Figure 8 Among them, the same reference numerals are assigned to the same or equivalent constituent elements to omit repeated explanations.

[0027] figure 1 It is a schematic diagram showing the vacuum evacuation system 10 according to the first embodiment of the present invention. Such as figure 1 As shown, the vacuum exhaust system 10 is a system for exhausting the vacuum chamber 12 used in the semiconductor manufacturing process or the liquid crystal manufacturing process to a vacuum, including: 2 vacuum pumps 20, 30; connecting the front vacuum pump 20 and the rear stage The connecting pipe 40 of the vacuum pump 30 ; the pressure sensor 50 for detecting the internal pressure of the connecting pipe 40 ; and the control unit 60 for controlling the vacuum pumps 20 and 30 . The pressure sensor 50 detects the ...

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Abstract

This invention provides a vacuum exhaust system capable of operating in a condition most optimum for the process conditions, to enhance the efficiency of the vacuum exhaust system. The vacuum exhaust system 10 is provided with vacuum pumps 20, 30, and a pressure sensor 50 disposed in a vacuum zone of the vacuum exhaust system 10. Each one of vacuum pumps 20, 30 includes a pair of rotors for delivering a gas, an electric motor for rotating the pair of rotors, a timing gear for synchronizing the pair of rotors, and a driver 26, or 36 for controlling the rotation speed of the electric motor. The vacuum exhaust system 10 is further provided with a control unit 60 for controlling the rotation speed of the rotors through the driver 26 or 36 of the vacuum pump 20 or 30.

Description

technical field [0001] The present invention relates to a vacuum exhaust system, and in particular to a vacuum exhaust system for exhausting a vacuum chamber into a vacuum used in a semiconductor manufacturing process or a liquid crystal manufacturing process. Background technique [0002] Conventionally, in a semiconductor manufacturing process, a liquid crystal manufacturing process, etc., a vacuum evacuation system for evacuating a vacuum chamber to a vacuum is used. In this vacuum evacuation system, the vacuum pump operates at a rated value irrespective of the conditions of the semiconductor manufacturing process, the liquid crystal manufacturing process, and the like. However, after the rated operation of the vacuum pump is continued regardless of the processing state, the load on the vacuum pump increases as the amount of gas delivered by the vacuum pump (gas load) increases. Therefore, there is a problem that the efficiency of the vacuum exhaust system is lowered, an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F04D27/00F04C28/00F04B49/00
CPCF04B37/14F04C25/02F04C29/0092F04D9/048H01L21/02
Inventor 田中敬二杉浦哲郎香川浩一
Owner EBARA CORP
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