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Tire electronics assembly having a multi-frequency antenna

A multi-frequency antenna and electronic component technology, applied to tire parts, antenna parts, antennas, etc., to reduce mechanical deformation and improve mechanical strength

Inactive Publication Date: 2006-03-01
MICHELIN & CO CIE GEN DES ESTAB MICHELIN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although various tire electronic system and antenna configurations have been developed as described above, none of the designs can comprehensively cover all the advantageous features presented in accordance with the technical subject of the present invention described below

Method used

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  • Tire electronics assembly having a multi-frequency antenna
  • Tire electronics assembly having a multi-frequency antenna
  • Tire electronics assembly having a multi-frequency antenna

Examples

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Embodiment Construction

[0028] As discussed in the Summary of the Invention section, the present invention specifically relates to tire electronics assemblies capable of conveying various tire identification information as well as measurements of selected physical states of the tire. Figure 1 and figure 2 An example of a tire component is shown, including such an electronic component located inside the tire structure. This tire electronics assembly uses a modified antenna structure that can efficiently propagate signals at multiple frequency levels. This multi-frequency antenna structure can be designed with improved mechanical strength and general communication capability. exist Figure 3A , 3B Exemplary embodiments of such electronic assemblies are shown in and 6A-9.

[0029] Certain combinations of disclosed technical content correspond to various embodiments of the invention. It should be noted that the illustrative embodiments presented and discussed herein are not intended to limit the in...

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Abstract

A tire assembly with integrated electronic components includes a tire structure and an integrated electronics assembly, which preferably includes at least a radio frequency (RF) device and a multi-frequency antenna that enables wireless communication in at least first and second resonant frequency bands. Such multi-frequency antenna further comprises at least first and second antenna wires connected to the RF device, thus facilitating the transmission of RF signals which may include information such as tire identification information or measured condition information such as tire temperature, pressure, and other characteristics. The first and second antenna wires preferably function together as at least two dipole antennas, for example, two half-wave dipole antennas or one half-wave dipole antenna and one three-half-wave dipole antenna.

Description

technical field [0001] In general terms, the present invention relates to tire electronics assemblies for communicating various tire identifying information and / or selected physical state measurements of the tire. More specifically, the subject tire electronics assembly utilizes a modified antenna structure that enables efficient signal propagation at multiple frequency levels. This multi-frequency antenna structure can be designed with improved mechanical strength and general communication capability. Background of the invention [0002] The combination of pneumatic tire construction and electronics yields many practical benefits. Tire electronics may include sensors and other components to communicate tire identification parameters as well as obtain information about various physical parameters of the tire, such as temperature, pressure, tire revolutions, and vehicle speed, among others. This performance information is very useful for tire monitoring and warning systems,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B60C23/00G08C17/02G01D21/00B60C23/04G01D21/02H01Q1/22
CPCH01Q1/2241B60C23/0433B60C23/0452B60C23/0493G01D21/02H01Q1/22H01Q5/371B60C23/0408G06K19/07749G06K19/07764G06K19/07786H01Q1/2208
Inventor J·D·亚当松P·F·金
Owner MICHELIN & CO CIE GEN DES ESTAB MICHELIN
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