Device for measuring thermal coefficient

Abstract

The invention discloses a heat conducting coefficient measuring device which consists of a sealed heat insulation device and a vacuum system. The heat insulation device consists of heat source, two metal blocks, samples, a cooling device. The heat insulation device is made by spark-plasma sintering the aluminum oxide ceramic basal material with carbon nanometer tube uniformly arranged in with a intensity of 5 to 10 percent. The carbon nanometer tube distributes along the direction perpendicular to the direction which the heat travels. By pumping out the inner gas with the vacuum system, the adverse effect of the gas is eliminated which the carbon nanometer tube reflect the heat back in consequence that the carbon nanometer tube is radial heat insulation.

Description

【Technical field】 [0001] The invention relates to a thermal conductivity measuring device, in particular to a thermal conductivity measuring device with good heat insulation effect. 【Background technique】 [0002] In the process of developing functional materials, it is often necessary to measure the thermal conductivity of the thermally conductive material, especially for thermally conductive materials, such as thermally conductive adhesives, whose thermal conductivity affects the thermal conductivity of the final product. In the design process of heat sinks for electronic components, it is necessary to pre-calculate and simulate their thermal conductivity. Accurately measuring the thermal conductivity of heat-conducting materials can reduce the number of tests and development costs, so it becomes the key to development and design. [0003] At present, there are two main methods for measuring the thermal conductivity of materials: [0004] 1. Laser scintillation method. T...

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Problems solved by technology

[0011] The method and device disclosed in the above-mentioned patents are easy to use, and the measurement cost is also low, but they have the following disadvantages: First, air will inevitably be left inside the device 9, which will affect the measurement accuracy, especially when the test sample is a jelly or porous object When, for example, heat-conducting glue, the sample contains a large amount of gas, which not only brings in gas, but also the thickness of the sample cannot be accurately measured due to the presence of gas, causing the existing measuring device to be powerless for such samples; secondly, heat insulating materials such as alumina Ceramics, its thermal insulation performance is still insufficient, and cannot meet the requirements of higher measurement accuracy; again, it needs to fill the thermal insulation material into the casing 13 to form the thermal insulation cover 14, and heat source 15, temperature sensor 16 and heating plate 10 Pre-wrapped in the heat insulation cover to prevent heat loss, this design is not conducive to the installation and maintenance of the heat source 15 and the measuring sensor 16

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