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Semiconductor device and producing method thereof

一种制造方法、半导体的技术，应用在半导体/固态器件制造、半导体器件、半导体/固态器件零部件等方向，能够解决散热性能限制、限制小型化、薄型化、轻量化等问题，达到减小环境负担、抑制颗粒污染、良好散热性能的效果

Inactive Publication Date: 2010-05-12
SANYO ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the presence of the supporting substrate, the overall thickness of the module increases, which limits miniaturization, thinning, and weight reduction, and also limits the improvement of heat dissipation performance to a certain extent.

Method used

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  • Semiconductor device and producing method thereof
  • Semiconductor device and producing method thereof
  • Semiconductor device and producing method thereof

Examples

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Embodiment Construction

[0039] FIG. 2 is a cross-sectional view showing steps of a method of manufacturing a semiconductor device in an embodiment of the present invention.

[0040] FIG. 2( a ) shows a laminated body in the process of manufacturing a semiconductor device. Here, the laminate includes: a metal foil 402; a multilayer wiring structure 455 formed on the metal foil 402; a first circuit element 410a and a second circuit element 410b formed on the multilayer wiring structure 455; a cover circuit element 410a and the enclosing film 415 of the circuit element 410b. The multilayer wiring structure 455 has: an interlayer insulating film 405; a coated metal interlayer 403 disposed in the interlayer insulating film 405; a wiring 407 electrically connected to the coated metal interlayer 403 and a cut wiring 408; The wiring 407 and the insulating film 409 of the wiring 408 are cut. Here, the description of the multilayer wiring structure 455 is omitted, but the multilayer wiring structure 455 has ...

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PUM

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Abstract

The semiconductor device comprises: an interlayer insulating film 405 and an insulating film 409, interconnect lines 407, 408a and 408b embedded in the insulating film 409, circuit elements 410a and 410b mounted on the insulating film 409, a packaging film 415 formed so as to cover the circuit elements 410a and 410b, and an electroconductive shielding film 416 formed so as to cover the packaging film 415. The interconnect lines 408a and 408b are configured to be electrically coupled to the shielding film 416.

Description

technical field [0001] The present invention relates to a semiconductor device mounted with circuit elements and a method of manufacturing the same. Background technique [0002] Now, as portable electronic devices such as mobile phones, PDAs, DVCs, and DSCs accelerate to achieve high performance, the LSIs used in these electronic devices are also required to have stronger functions and characteristics. Therefore, the operating clock pulse of the LSI is also To achieve high frequency. In addition, in order to make these electronic devices better meet market requirements, they must be miniaturized and lightweight. A highly integrated LSI is required to achieve the above purpose. [0003] In order to install such a small high-frequency LSI, the distance between semiconductor chips must be shortened to form a high density, so there will be a problem of increased clutter interference. At present, the invention of covering the components in the semiconductor device with a metal...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/28H01L23/12H01L21/56H01L21/60H01L23/31H01L23/498H01L23/552
CPCH01L2924/01023H01L2924/19105H01L2924/01046H01L2924/01082H01L2221/68345H01L2224/97H01L2224/16H01L23/3128H01L2924/15311H01L2924/01029H01L23/49822H01L24/24H01L2224/48091H01L2224/49171H01L2924/01013H01L2924/01024H01L2224/32225H01L24/97H01L2224/24145H01L2924/19043H01L2924/01047H01L2224/73204H01L24/48H01L2924/01079H01L2224/48463H01L2224/48227H01L2924/14H01L2924/01005H01L2924/01033H01L2924/01006H01L24/49H01L2924/0102H01L2924/01078H01L23/552H01L2224/45144H01L2224/73265H01L2924/3025H01L2924/12042H01L24/45H01L24/73H01L2924/181H01L2224/05554H01L2924/00014H01L2224/85H01L2224/83H01L2924/00H01L2924/00012H01L2224/0401
Inventor 臼井良辅
Owner SANYO ELECTRIC CO LTD
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